Analyst: Strong IC rebound to start in second half News & Analysis 4/9/2009 Post a comment Spurred by pent-up electronic system demand and increasing average selling prices, the IC market will register double-digit growth in 2010 and 2011 after beginning to recover in the second half of this year, according to market research firm IC Insights.
Startup to show power analysis EDA at DATE News & Analysis 4/9/2009 Post a comment Design-for-power startup company Docea Power SA (Moirans, France) has said it will attend the DATE (Design Automation and Test Europe) exhibition in Nice, France, taking place April 21 to 23, 2009, and exhibit version 1.1. of its ACEplorer software.
Are 'primary vendor' deals bad for EDA? News & Analysis 4/7/2009 Post a comment Critics charge that the current fad for customers of Synopsys to consent to public announcements saying they've selected the No. 1 EDA vendor as their primary supplier of design tools is bad for EDA, stifling innovation and hurting overall tool pricing. But are these complaints about a competitor legitimate, or just sour grapes?
Innovative heat sink designs cool "hot" FPGAs Design How-To 4/7/2009 Post a comment While the power dissipated by FPGAs is growing, the space allocated to cool these chips is shrinking. In recent years, makers of thermal management products have introduced a wide array of new heat sinks that provide more cooling in a given volume. This article will help engineers looking for more-powerful heat sinks by describing recent innovations in heat sink design and analyzing their impact on heat sink performance.
Fourth quarter EDA revenue down 18% News & Analysis 4/7/2009 Post a comment EDA revenue in the fourth quarter of 2008 totaled $1.32 billion, down 17.7 percent from the fourth quarter of 2007, according to data released by the EDA Consortium Market Statistics Service.
Pyxis Technology raises $3 million News & Analysis 4/7/2009 Post a comment EDA firm Pyxis Technology, Inc. has raised $3 million in financing to accelerate the deployment of its new High-performance Custom (HPC) routing product, NexusRoute-HPC.
Overcome LTE PHY challenges using ESL design Design How-To 4/6/2009 Post a comment Electronic System Level (ESL) design aims to be a comprehensive design and verification methodology for LTE design and this article aims to introduce some of the design challenges that may be encountered in designing the physical layer (PHY) for LTE, while also showing how ESL tools can help create executable specs to help overcome those design challenges.
U.S. high-tech jobs grew again in 2008, says study News & Analysis 4/5/2009 Post a comment Overall U.S. high-tech employment increased in 2008 for the fourth consecutive year, as net job gains in software services and engineering and tech services offset declines in high-tech manufacturing, particularly within the semiconductor industry, according to a study released last week.
Video: Where hardware and software collide News & Analysis 4/4/2009 Post a comment A panel of executives at ESC Silicon Valley talked about the clash of cultures between hardware and software engineers as chipmakers take on the responsibility of developing more embedded software and agreed that a system-level approach has become mandatory.
edacentrum workshop seeks European EDA networking News & Analysis 4/3/2009 Post a comment Against the background of the economy crisis, Electronic Design Automation researchers are seeking to intensify their pan-European contacts. For this reason, German edacentrum will hold his edaWorkshop together with the Design Technology Conference (DTC) of the European research initiatives Medea+ and Catrene.
Counterpoint: Meeting with the unexpected Blog 4/3/2009 4 comments At trade shows these days, everyone wants to know the number of attendees. This tends to drown out a somewhat more important issue: the quality of the show. But when we walk into unexpected encounters with people we've never met before at a trade show, we are always reminded of one thing: This is why we travel.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.