Straightforward DDR SDRAM Connection to FPGAs Using IP News & Analysis 8/28/2003 Post a comment Double Data Rate (DDR) SDRAM is now the most popular memory type for designers of embedded applications needing large amounts of low-cost, high-performance memory. Thanks to widespread adoption by the PC industry, and improved long-term availability over SDR SDRAM, it also makes good commercial sense for use in today's applications.
Structured-ASIC debate building in fervor News & Analysis 8/25/2003 Post a comment A custom-chip design approach that was initially dismissed by critics as a fad is proving to have staying power as system architects increasingly seek a middle ground between cell-based designs and FPGAs. Crista Souza has these insights.
SOI and strained silicon complement each other News & Analysis 8/22/2003 Post a comment For the past 25 years, geometric scaling of silicon CMOS transistors has enabled not only an exponential increase in circuit integration density Moore's Law but also a corresponding enhancement in the transistor performance itself.
Silicon germanium challenges metrology Design How-To 8/22/2003 Post a comment To enable continued migration to smaller design rules in advanced CMOS processes, the semiconductor industry must deal with a proliferation of materials-from 20 materials options at the 130-nanometer node to nearly double that at the 65-nm node.
Right on time -- requirements for advanced custom design News & Analysis 8/22/2003 Post a comment Custom IC design is becoming phenomenally more complex. In this whitepaper, Cadence Design Systems authors Lavi Lev and Ted Vucurevich analyze today's custom design flow and propose a new "advanced custom design" methodology that combines accuracy with fast turn-around times.
Inside composite substrates News & Analysis 8/22/2003 Post a comment In contrast to the current generation of bulk wafers, which typically are pure silicon, "engineered" substrates contain several materials layered one on top of the other.
Engineered substrates boost performance Design How-To 8/22/2003 Post a comment he race of the best-in-class chip makers toward the 65-nanometer and 45-nm technology nodes has accelerated the need for the integration of new materials such as metal oxides, porous low-k oxides, new silicides, metal gates and the like.
Programmable analog chases discrete market pricing News & Analysis 8/19/2003 Post a comment This isn't exactly "I told you so." Or maybe it is: Anadigm is dropping the entry price for its programmable analog chips below $5 to be more competitive with the discrete devices that they are designed to replace. Crista Souza reports.
Analog/mixed-signal optimization tool supports 1394 PHY design News & Analysis 8/18/2003 Post a comment The analog IC designer must constantly juggle tradeoffs between power, noise, silicon area, and bandwidth, says Analog Design Automation. The ability to evaluate a number of separate designs in the same EDA flow " and to display the results graphically on the same screen " helps the designer balance tradeoffs and improve time to market. This article, from the August 18th issue of PA magazine, suggests how.
Tips for firmware-friendly register design Design How-To 8/14/2003 Post a comment Adding further detail to his previous tutorials, LSI Logic's "firmware friendly" engineer, David Fechser, shows you how to design register bit fields and handle "Go" bits in a way that facilitates firmware design.
It's Time to Return to 10x Passion Blog 8/6/2003 Post a comment As the leaders of the high-tech industry emerge from their bubble bust and
lingering budget hangovers, they will once again start yearning for the good old
days when their EDA suppliers were focused and were investing in the next 10x
gain in productivity and predictability.
The truth is that achieving the next 10x will take innovation and conviction.
Why We Don't Have IP Quality Yet Blog 8/6/2003 Post a comment IP quality has now become an overall issue in the IC industry, because the
predictions that organizations like VSIA made back in the mid 1990s have become
reality. The combination of the convergence of electronic products, coupled with
the relentless march to chips that can contain tens of millions of gates today,
is making the integration of internal and 3rd party IP the only economically
viable way to create the next generation chips.
Startup unwraps power grid planning software News & Analysis 8/4/2003 Post a comment Turning adversity into opportunity, a design engineer laid off last year has used his lighter schedule to develop a block-level power grid noise simulator he had thought about for years. Donald Bennett formed RLCSim Co. (Lochore, Scotland) to market the tool, named RLCSim, which Bennett described as the market's first pre-layout planning tool.
Analyzing inductive noise in power grids Design How-To 8/1/2003 Post a comment Inductance in IC interconnects is a serious problem for GHz designs. This article by Donald Bennett, principal of EDA startup RLCSim Company, shows how transmission line theory techniques can be used at the pre-layout stage to analyze resistive, inductive and capacitive effects.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.