Correlating behavioral cycle time with HDL simulation News & Analysis 8/28/2004 Post a comment Transaction-based behavioral models speed verification, but correlating behavioral cycle time with HDL simulation time is tough. In this tutorial Debra Klopfenstein (right), a verification engineer at Silicon Graphics, uses a simulation example to show you how to do that.
EDA-Markterholung noch nicht in trockenen Tüchern News & Analysis 8/27/2004 Post a comment Für das erste Quartal meldete die EDA-Branche ein Wachstum von 6 Prozent. Doch noch ist es zu früh, um die Sektkorken knallen zu lassen. Denn der Großteil des Wachstums ging nicht auf EDA-Produktverkäufe zurück und fand auch nicht in Nordamerika, Europa oder Japan statt.
Mentor kauft Speicher-IP von Palmchip News & Analysis 8/27/2004 Post a comment Mentor Graphics hat Palmchips Geschäftszweig für geistiges Eigentum (IP) für parallele und serielle ATA-Speicherlösungen übernommen. Wie tief Mentor dafür in die Tasche greifen musste, blieb geheim.
Synopsys faces shareholder suits News & Analysis 8/26/2004 Post a comment Several law firms have filed or have indicated their intent to file shareholder class-action lawsuits in the wake Synopsys' drastic stock price drop last week.
Stratos Lightwave performs testing and eval services for opto systems Product News 8/25/2004 Post a comment Stratos Lightwave LLC has announced new services for performance testing and verification of opto-electronic products and systems used in harsh operating environments, specifically for military, commercial aviation, or industrial applications. These product testing and evaluation services provide optical system designers with validation of proper optical performance, environmental testing, and failure analysis.
Hard macros will revolutionize SoC design News & Analysis 8/20/2004 Post a comment A surprising proliferation of hard macros has become a "quiet revolution" in SoC design, say Monterey Design Systems authors including CTO Enno Wein (right). This article shows why it's happening, and how it will impact chip cost and design.
Synopsys cuts revenue estimates News & Analysis 8/19/2004 Post a comment In a sign the EDA industry recovery may be losing steam, Synopsys Inc. announced a third-quarter revenue shortfall and cut $80 million from its fiscal 2004 and $450 million from its 2005 revenue estimates.
ZiLOG Adds ROM-based items to Crimzon MCU line Product News 8/18/2004 Post a comment ZiLOG, Inc. has rolled-out its Crimzon MCU Family of infrared microcontrollers. Available immediately, the ZLR16300 devices are 100 percent software compatible with ZiLOG's current Crimzon family of OTP-based IR MCUs.
Embedded 64-Bit MPUs -- The Myths and Realities Product News 8/17/2004 Post a comment Opinion: Jerry Worchel principal analyst, Digital Engines Service, In-Stat/MDR sees a bright future for 64-bit microprocessors down the road. As the capabilities and demands on the Internet and wireless communications begin to rapidly expand into a broader breadth of functional offerings, the requirement for wider processor bus widths will rapidly follow, according to Worchel.
Improving yields without compromising area News & Analysis 8/13/2004 Post a comment Design for manufacturability (DFM) often brings design rules that conflict with area minimization goals, says Prolific CEO Paul de Dood (right). In this article, he shows how design rules can balance yield and area concerns.
Cadence links PSpice to Matlab News & Analysis 8/11/2004 Post a comment Linking two widely-used electronic design products, Cadence Design Systems has announced an interface between its PSpice analog simulator and the Matlab modeling tool from The Mathworks. The interface allows the co-simulation of electrical and mechanical systems.
Spice algorithm analyzes high-gain feedback News & Analysis 8/9/2004 Post a comment Extending Spice to realms where ac analysis has been difficult, Intusoft CEO Larry Meares has developed an algorithm that promises dc convergence for circuits with cascaded high-gain amplifiers. The algorithm is being incorporated into Intusoft's IsSpice4 simulator.
EEsof rolls advanced EDA test Product News 8/9/2004 Post a comment Agilent Technologies is debuting new EDA capabilities that enable simulation and verification of wireless LAN, 3GPP, and TD-SCDMA circuit designs. Agilent is introducing wireless test benches, sources, and measurement capabilities for its existing Advanced Design System 2004A EDA software from EESof.
Getting inside the SiP News & Analysis 8/9/2004 Post a comment Many design teams are taking a harder look at the system-in-package alternative to conventional system-on-chip design. The advantages of combining multiple dice in one package have been well-documented.
Cu links on the straight and narrow News & Analysis 8/9/2004 Post a comment Semiconductor devices now operate at internal clock speeds that far outstrip the electronic interconnection infrastructure's ability to support them. Although optoelectronic technologies have been considered as potential solutions for short-range transmission, serious impediments remain, with high cost and power near the top of the list. Traditional copper technology appears to be a better choice for now.
SiPs pose considerations for die design News & Analysis 8/9/2004 Post a comment Semiconductor technology has always been driven by the need for enhanced features and functionality, while reducing size and cost. While system-on-chip technology promises many advantages to system architects and designers, system-in-package has become the more practical approach to miniaturization in many cases today.
A systems approach delivers SiP design News & Analysis 8/9/2004 Post a comment The soaring popularity of cellular telephones and digital still cameras, with their demand for small-form-factor semiconductor packages, has made system-in-package (SiP) solutions increasingly popular. But SiP isn't just about size: Because each functional chip can be developed individually, SiP means faster development and lower cost than a system-on-chip (SoC), which must be developed as one large single-chip design.
Analog BIST locates good dice News & Analysis 8/9/2004 Post a comment System-in-a-package technology is, by definition, driving the need for multiple dice in the same package. This trend, in turn, is driving the need for known-good dice.
Management of Technical Details Further Enhances Benefits of System-In-Package (SIP) Technology News & Analysis 8/9/2004 Post a comment There are many trade-offs to consider when making an integration decision between system-in-package and system-on-chip technologies. Generally, SoC offers the primary benefits of reduced costs and improved system performance through the design and optimization of multiple disparate system functions on a single die. SoC devices are generally driven by a requirement for increased system performance, reduced cost and/or smaller size.
Component Partitioning for System in Package (SiP) Applications News & Analysis 8/9/2004 Post a comment Timely and effective development of system-in-package (SiP) alternatives has driven the need for broader supplier collaboration on system-partitioning decisions within the electronics food chain. Unlike earlier generations of electronics with individually packaged components, packaging subcontractors and semiconductor device manufacturers today must work together to define the most effective partition options available.
My Spice lied to me! Why is this such a common complaint? Design How-To 8/7/2004 Post a comment Take a precision razor (the Spice engine), insert a crappy blade (the Model); the result will be a guaranteed terrible shave, says this analog rascal. Those of you who remember Bill Pacoe's colorful and informative talks at the Analog and Mixed-Signal Applications Conferences will find this an interesting reprise.
Is SystemVerilog the next PL/1? News & Analysis 8/6/2004 Post a comment Design and verification are two distinct tasks that should not be forced into a single language, says Tommy Kelly, CEO of consulting firm Verilab, in this contrarian view of SystemVerilog.
Modeling and design techniques reduce 90 nm power News & Analysis 8/6/2004 Post a comment With small feature sizes, designers must work harder to reduce dynamic and leakage power. Magma Design Automation's Robert Jones (right) presents design and modeling techniques, mostly using multiple or variable voltages, that will help reduce power challenges.
IC design conference calls for papers News & Analysis 8/6/2004 Post a comment The International Symposium on Physical Design (ISPD) has issued a call for papers, and has announced that next year's conference will be held April 3 " 6 at the Marine Memorial Hotel in San Francisco, Calif. A premier showcase for research in IC physical design, ISPD draws attendees from industry and academia.
Synthesis suite targets unconventional designs News & Analysis 8/6/2004 Post a comment FTL Systems is quietly preparing a complete IC design solution, but this small, privately held company isn't about to go head-to-head against the big EDA vendors. Instead, the company said it is focusing on problems that conventional EDA tools can't solve most notably ICs that are asynchronous or require radiation hardening or have huge gate counts.
Fujitsu und Cadence feilen gemeinsam an SoCs News & Analysis 8/5/2004 Post a comment 151 Der japanische Halbleiterhersteller Fujitsu und der EDA-Anbieter Cadence Design Systems wollen gemeinsam eine neue SoC-Designumgebung entwickeln. Die beiden Unternehmen haben zu diesem Zweck eine weltweite Partnerschaft abgeschlossen.
Mohsen pleads not guilty as judges abandon case News & Analysis 8/4/2004 Post a comment Facing 23 criminal counts including solicitation to murder a federal judge, former Aptix CEO Amr Mohsen entered not guilty pleas on all counts at an arraignment Wednesday (Aug. 4). But there was no judge to hear them, because all judges in the Northern District of California have recused themselves from the case.
Prolific to team with DongbuAnam on tools, IP Product News 8/4/2004 Post a comment Prolific Inc., a provider of automated standard cell creation software, has announced a partnership with pure-play wafer foundry DongbuAnam Semiconductor covering software, standard cell IP, and implementation services for the latter company's advanced digital and mixed-signal technologies.
Une jeune pousse française de CAO cible la conception sur mesure News & Analysis 8/4/2004 Post a comment De la recherche doctorale à l’Université de Paris, au logiciel commercial de CAO vendu à l’échelle mondiale, il y a un pas à franchir. La jeune pousse française de CAO Avertec franchit ce pas en inaugurant un nouveau bureau aux États-Unis et en proposant sa technologie d’intégrité du signal.
Synopsys prévoit un manque à gagner pour le troisième trimestre News & Analysis 8/4/2004 Post a comment Selon un avertissement émis le lundi 2 août, Synopsys n’atteindra pas les prévisions de bénéfice net et de recettes pour le troisième trimestre de l’exercice clos le 31 juillet 2004. Synopsys, qui avait dépassé l’an dernier son principal rival, Cadence Design Systems, en termes de recettes totales, pourrait maintenant perdre son avance.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.