Magma posts loss, amends tender offer News & Analysis 8/31/2009 Post a comment Magma Design Automation posted a loss in accordance with generally accepted accounting principles of $4.3 million on revenue of $28.8 million for the first quarter of its fiscal 2010, the company reported last week.
Globalfoundries in multi-year contract with Cadence News & Analysis 8/31/2009 Post a comment Foundry services provider Globalfoundries has signed a multi-year technology contract with semiconductor design software vendor Cadence Design Systems. The deployment covers large parts of the design chain including verification and manufacturing.
SoC design issues going virtual Blog 8/29/2009 Post a comment A dramatic shift is taking place in the technical conference area: provide an entire design-oriented conference and exhibits to millions of desktops across the globe.
From 2009 to 2020: A history of developments in programmability Signal Processing DesignLine Blog 8/28/2009 3 comments Predictions come easy, but from the demise of FPGAs to the emergence of 32-core processors, DSPs are showing some strong trends and I think it is possible to divine what will happen in the next few years as we move towards the next order of magnitude increase in computational efficiency.
Nvidia offers $5,000 in prizes to Cuda programmers News & Analysis 8/27/2009 1 comment Graphics chipmaker Nvidia Corp. (Santa Clara, Calif.) has said it plans to offer prizes totaling $5,000 to five programmers who use the Cuda parallel programming environment to solve the first of a series of challenges.
Startup rewrites NXP’s legacy in 3D passive integration News & Analysis 8/27/2009 Post a comment Economic crises can have positive as well as negative impacts. Thus, if NXP had not divested its wireless business and decided to sell its integrated passives device unit near Caen, Normandy (France), Ipdia would not have emerged with an ambition to deliver next-generation 3D-SiP modules for various applications, including advanced LED modules.
Dresden is like Silicon Valley: hungry talent & excellent education News & Analysis 8/27/2009 1 comment How comes that the Dresden area is the most remarkable center for start-up activities in Germany? The answer is that in the town, all ingredients necessary such as excellent mathematical education and a generation of engineers with great ideas meet. The ignition spark, however, has been imported from the U.S. – in person of Gerhard Fettweis, professor at the Dresden Technical University. In the interview Fettweis explains what are the essentials for start-up friendly environments and which techn
Arasan adds MIPI to IP stable Product News 8/27/2009 Post a comment Arasan Chip Systems, Inc. has released its MIPI (Mobile Industry Processor Interface) High Speed Synchronous Interface (HSI) controller IP and software stack.
NIWeek photo shoot (part 1) Test & Measurement Designline Blogs 8/25/2009 Post a comment It's been a few weeks since I attended NIWeek in Austin, but I still have more content coming from that show. I did manage to bring my digital camera and take some pictures. Here is the diary of my two and a half days there--in image form (part one).
Making bare essentials work Blog 8/25/2009 Post a comment Startup siXis Inc. claims mounting bare die on a wafer-scale silicon circuit board essentially eliminates the power-hungry soldered interconnections between packages.
Carbon nanotube interconnect startup raises $4.1 million News & Analysis 8/25/2009 Post a comment Surrey NanoSystems Ltd. (Newhaven, England) has raised £2.5 million (about $4.1 million) in second round venture capital to help it develop a silicon-friendly, low-temperature carbon nanotube growth process. Surrey NanoSystems believes CNTs can be used as semiconductor interconnect.
Engineer seeks $60 million bonus from Atmel News & Analysis 8/25/2009 3 comments Dr. Andreas Paul Schueppen, a former employee of Atmel Germany GmbH, is preparing for his first day in court in a case filed against his former employer in which he is claiming he is owed 42 million euro (about $60 million) as an "inventor's bonus."
Simplifying design of industrial process-control systems with PLC evaluation boards (Part 1 of 2) Design How-To 8/24/2009 1 comment
PLC evaluation board applications for industrial process-control systems are diverse, ranging from simple traffic control to complex electrical power grids, from environmental control systems to oil-refinery process control. This two-part series looks at using a PLC evaluation board to simplify design, with a practical example application outlined including schematics and tutorial on using the system.
Silicon circuit board seeks to replace ASICs News & Analysis 8/24/2009 Post a comment You may be able to kiss that printed-circuit board good-bye soon, instead mounting bare die on a wafer-scale silicon circuit board that essentially eliminates the power-hungry soldered interconnections between packages.
TSMC makes SRAMs in three 28-nm processes News & Analysis 8/24/2009 Post a comment Foundry chipmaker Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) has claimed it has achieved a functionally yielding 64-Mbit SRAMs across all three versions of its upcoming 28-nm manufacturing process technology. These are 28-LP, with an oxynitride dielectric, and 28-HP and 28-HLP which both uses a high-K metal gate process.
Good project management keeps remote MindTree, TI teams in sync News & Analysis 8/24/2009 1 comment India-based MindTree was heavily involved in software development for TI's wireless solutions involving OMAP and mobile connectivity. Keeping the project in line depended as much on good technical expertise as it did upon good trans-global, cross-cultural project-management skills.
C-to-FPGA compiler supports Virtex-6, Spartan-6 Product News 8/24/2009 Post a comment The CoDeveloper C-to-FPGA compiler from Impulse Accelerated Technologies has been updated to support the latest devices and software from Xilinx, including the Virtex-6 and Spartan-6 FPGAs and Version 11.2 of Xilinx ISE design suite, Impulse said.
Mentor tops expectations News & Analysis 8/20/2009 Post a comment EDA vendor Mentor Graphics reported revenue of $182.6 million for the quarter ended July 31, besting consensus analyst expectations by a wide margin.
Omnivision licenses Slovenian IP cores News & Analysis 8/20/2009 Post a comment Omnivision Technologies Inc. (Sunnyvale, Calif.), a fabless developer and vendor of CMOS image sensors, has licensed semiconductor intellectual property from Beyond Semiconductor (Ljubljana, Slovenia).
Tower, Jazz team with SVTC on MEMS for aerospace, defense News & Analysis 8/20/2009 Post a comment Tower Semiconductor Ltd. (Migdal Haemek, Israel) and its U.S. subsidiary Jazz Semiconductor Inc. (Newport Beach, Calif.) have announced an agreement signed with SVTC Technologies LLC to provide SVTC's aerospace and defense customers with access to Jazz process technologies and manufacturing facilities.
TimingDesigner interfaces with Allegro PCB SI Product News 8/18/2009 Post a comment EMA Design Automation announced the availability of EMA TimingDesigner 9.2, which interfaces with the Cadence Allegro PCB signal integrity technology to provide what the company calls a complete SI and timing design environment.
Jazz sees growth opportunities for SiGe Product News 8/18/2009 Post a comment Jazz Semiconductor Inc. (Newport Beach, Calif.), a subsidiary of foundry chip maker Tower Semiconductor Ltd. (Migdal Haemek, Israel), has announced it is looking to use its silicon-germanium BiCMOS technology to replace GaAs components in millimeter wave and cell phone applications.
TSMC on equipment spending spree News & Analysis 8/17/2009 Post a comment TSMC is on a buying spree, spending more than $250 million on semiconductor capital equipment in recent weeks, according to regulatory filings made by the silicon foundry giant.
IBM harnesses DNA to pattern nanoscale circuits News & Analysis 8/17/2009 Post a comment IBM Corp. researchers say they have harnessed DNA to position nanoscale components like carbon nanotubes and silicon nanowires into circuits 10 times smaller than can be achieved with current lithographic techniques.
Virtual testing with model-based design Design How-To 8/17/2009 1 comment Virtual testing, based on system simulation and model-based design,
takes the traditional "test-at-the-end" system development process
and makes it more iterative. Virtual
testing shortens both the design cycle and the final physical testing
IEEE helps spawn industry collaborations News & Analysis 8/17/2009 Post a comment A group of security companies have become the first to pilot the IEEE's Industry Connections program, an effort to extend the IEEE's umbrella of support it offers its standards efforts to broader groups of companies that want to set up collaborations quickly.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.