Zuken rolls out synthesizer for stacked-die packages News & Analysis 9/26/2000 Post a comment WESTFORD, Mass. -- Zuken Ltd.'s U.S. subsidiary here today announced development of a three-dimensional package synthesizer for placement and wiring of multiple chips in 3-D, stacked-die packages. Zuken said it expects to deliver the new 3-D synthesizer to development partner Amkor Technology Inc. by the end of the year. Amkor will have exclusive use of the tool for six months, under its agreement with U.K.-based Zuken.
Xilinx buys formal verification technology from French EDA company News & Analysis 9/21/2000 Post a comment SAN JOSE--Xilinx Inc. today announced the purchase of formal design verification technology from Veriphia, a French electronic design automation company based in Sophia-Antopolis. Along with the purchase of Veriphia's formal verification tool suit, Xilinx said it has hired key engineers responsible for the development of the technology. The verification is expected to complement support for Xilinx's 10-million gate field-programmable gate arrays (FPGAs).
Toshiba says embedded DRAM gets pure-logic performance News & Analysis 9/11/2000 Post a comment TOKYO -- Toshiba Corp. has introduced an 0.18-micron embedded DRAM ASIC process that boasts logic-transistor performance equal to a pure-logic process. At the same time, Toshiba said it has managed to reduce by 20% the process steps normally required to merge logic and DRAM processes.
Artisan to add 0.13-micron design library for TSMC processes News & Analysis 9/8/2000 Post a comment SUNNYVALE, Calif.--Artisan Components Inc. today announced an agreement with Taiwan Semiconductor Manufacturing Co. Ltd. to develop a IC-design library for TSMC's 0.13-micron process technology. The development and licensing pact will provide Artisan customers with a unified library supporting multiple process generations--from 0.25- down to the new 0.13-micron technology node at TSMC, said the Sunnyvale company.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.