Oxide isolation ramps next-gen process News & Analysis 9/23/2002 Post a comment Roughly every two years for the last decade and a half, a scaled CMOS technology generation has been introduced with about 70 percent smaller linear dimensions than its predecessor and transistors approximately 30 to 40 percent faster.
ICs tailored for exotic substrates News & Analysis 9/23/2002 Post a comment As we move into the 21st century, substrate manufacturers will acquire more responsibility in IC development with more complex, partially processed substrates tailored to specific applications.
SoC teams 8-bit core with FPGA News & Analysis 9/9/2002 Post a comment Most broadband solutions use high-end 32-bit processors coupled with large external memories and specialized media-access controllers (MACs), ASICs or FPGAs.
FPGAs boost wideband receivers Design How-To 9/9/2002 Post a comment Hardware multipliers have enabled FPGAs to invade such DSP territory as software radio, where they are now challenging both ASICs and programmable DSPs.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.