Engineering Bloopers at DesignCon 2016 Blog 1/25/2016 Post a comment Steve Sandler's session on engineering bloopers was a hit at DesignCon 2016. In this video, he describes a logic gate whose design makes the chip impossible to properly decouple and about impedances that don’t match.
Alliance Fast Tracks Ethernet Standards, Products News & Analysis 12/10/2015 Post a comment A year after forming, the NBASE-T Alliance is speeding up the
development and standardization Ethernet specifications with the IEEE 802.3bz standard. On its one-year anniversary, the group announced a new MAC-PHY specification and the addition of 14 new members.
Inside NXP Merger: Dos & Don'ts News & Analysis 12/9/2015 7 comments The first instinct for anyone working at chip companies about to go through mergers and acquisitions would be understandably to assume the worst: There goes your job. What should be your next step?
Gas Sensors Penetrate Smartphones News & Analysis 11/5/2015 3 comments Cambridge CMOS Sensors Ltd. claims to have a 1-by-1 millimeter die that can sense any pollution gas, in a package small enough to fit inside any smartphone.
Electromechanical Displays: The Nipkow Disk Engineering Investigations 10/4/2015 Post a comment How to get your oscilloscope to act like this maker favorite: the rotating contraption that makes a 3D display when spinning. Engineer Dennis Feucht has an idea to improve it. Maybe just in time for Halloween.
Compensate For Cable Voltage Droop Blog 9/30/2015 Post a comment Have you ever used an extra-long USB cable to charge your phone or tablet, only to find that it was taking an extra long time to charge? It probably wasn’t your imagination and was a situation that involved excessive voltage drop across the universal serial bus (USB) cable.
GE Connects Industrial IoT News & Analysis 9/30/2015 Post a comment Connecting manufacturing and industry to the Internet is the next great frontier for OEM and manufacturer General Electric. The company showcased analytics platforms alongside hardware at an industrial Internet event.
LTE-U, Wi-Fi Play Nice in Test News & Analysis 9/28/2015 4 comments Qualcomm wants to convince non-believers that LTE-Unlicensed (LTE-U) will be a good neighbor to Wi-Fi for next generation communications. Following debate about the realities of sharing spectrum, the chip giant discussed coexistence tests conducted at its San Diego lab.
Chips Slump as Drivers Falter News & Analysis 9/16/2015 1 comment The Internet of Things won’t be enough to revive a semiconductor industry amid slowing PC, tablet and smartphone drivers, a Gartner analyst said.
Smart Inks Monitor Glucose News & Analysis 9/10/2015 Post a comment Researchers at the University of California San Diego are working toward the holy grail of sensor technology – non-invasive glucose testing. A team at the school’s Jacobs School of Engineering developed high-tech bio-inks that react with several chemicals, including glucose, to create temporary sensors.
Giga-Scale Challenges Plague Memory Design Blog 8/27/2015 Post a comment Advanced designs are more complex and larger than ever before and designers are balancing between accuracy and performance for large scale memory simulation and verification, fine-tuning options and settings for each circuit type
Choosing The Best Control Method Blog 8/25/2015 Post a comment Fixed-frequency pulse-width-modulated (PWM) control for power supplies breaks down into two main categories: voltage mode (VM) and current mode (CM). To make the proper control choice, it’s best to examine the advantages and disadvantages of both.
Metallic Nanoparticles May Lower Solar Cost News & Analysis 7/29/2015 1 comment While the domestic solar energy industry grew 34% last year, fundamental technical breakthroughs are still needed to hit the national goal of reducing the cost of solar electricity to 6 cents per kilowatt-hour. Researchers at Rice University say they have found a way reduce the costs of photovoltaic solar cells.
ACE Awards Names NXP ‘Company of the Year’ News & Analysis 7/22/2015 1 comment In a year distinguished by a wave of mergers in the chip industry, NXP fired the opening salvo by announcing a merger plan with Freescale. The news stunned the world, but won overwhelming approval from shareholders, customers and employees.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.