Teradyne expects 20% drop in tester shipments in Q1 News & Analysis 1/17/2001 Post a comment BOSTON--Test equipment supplier Teradyne Inc. here posted $789.2 million in sales and a net income of $117.7 million for the fourth quarter of 2000, but the company also lowered projections for system shipments by 20% in Q1 this year from the just-ended period.
Amkor to open China IC-packaging/test plant News & Analysis 1/16/2001 Post a comment CHANDLER, Ariz.--Amkor Technology Inc. today announced plans to open its first chip assembly and testing plant in China as competition for IC-manufacturing services heats up in the communist country. Amkor said its new facility in Shanghai will initially assemble and test finished ICs for baseband processors and controllers in the third quarter of 2001.
Karl Suss develops probe head for measurements up to 110 GHz News & Analysis 1/11/2001 Post a comment MUNICH -- Karl Suss, a unit of Suss MicroTec AG, has introduced a new probe head for testing advanced communications devices with measurements up to 110 GHz. The PH300HF has been designed for stable measurements in the very high frequency (VHF) range without phase errors, said the company.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.