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Content tagged with Test & Measurement
posted in January 2001
Yokogawa, Ando team up to accelerate chip tester growth
News & Analysis  
1/31/2001   Post a comment
TOKYO -- Yokogawa Electric Corp. and Ando Electric Co. Ltd. today announced plans to collaborate in semiconductor test and measurement systems. At the same time, NEC Corp. disclosed it was planning to sell all of its shares in Ando to Yokogawa.
Teradyne system takes probers out of package test
News & Analysis  
1/30/2001   Post a comment
Making a more aggressive push into the wafer-probe space, Teradyne Inc. has unveiled a memory test system with an architecture specifically designed for high-parallel test and repair of DRAM wafers.
Corning will buy Tropel to expand into metrology, precision optics
News & Analysis  
1/23/2001   Post a comment
CORNING, N.Y. -- Corning Inc. here today announced plans to acquire Tropel Corp., a supplier of optical products and metrology instruments, for about $190 million in cash and stock.
Can China's IC-packaging rush sustain itself?
Blog  
1/19/2001   Post a comment
Analysis: Huge market potential, government policies, and fear of being left behind fuel expansion of final assembly plants.
Credence prepares for year-long downturn in chip-tester markets
News & Analysis  
1/18/2001   Post a comment
FREMONT, Calif.--Credence Systems Corp. here warned of lower-than-expected revenues for IC testers in its current fiscal quarter, ending Jan. 31, and the company's CEO said it could take up to one year for the industry to pull out of its apparent downturn in demand.
Teradyne expects 20% drop in tester shipments in Q1
News & Analysis  
1/17/2001   Post a comment
BOSTON--Test equipment supplier Teradyne Inc. here posted $789.2 million in sales and a net income of $117.7 million for the fourth quarter of 2000, but the company also lowered projections for system shipments by 20% in Q1 this year from the just-ended period.
Amkor to open China IC-packaging/test plant
News & Analysis  
1/16/2001   Post a comment
CHANDLER, Ariz.--Amkor Technology Inc. today announced plans to open its first chip assembly and testing plant in China as competition for IC-manufacturing services heats up in the communist country. Amkor said its new facility in Shanghai will initially assemble and test finished ICs for baseband processors and controllers in the third quarter of 2001.
Karl Suss develops probe head for measurements up to 110 GHz
News & Analysis  
1/11/2001   Post a comment
MUNICH -- Karl Suss, a unit of Suss MicroTec AG, has introduced a new probe head for testing advanced communications devices with measurements up to 110 GHz. The PH300HF has been designed for stable measurements in the very high frequency (VHF) range without phase errors, said the company.
August Technology claims major improvement in 3-D inspection
News & Analysis  
1/9/2001   Post a comment
BLOOMINGTON, Minn.--August Technology Corp. here today claimed a breakthrough in three-dimensional inspection technology by combining confocal microscopy with new a new optical design and software algorithms.
Hyundai, ChipPac forge foundry/backend assembly alliance
News & Analysis  
1/4/2001   Post a comment
SANTA CLARA, Calif. -- ChipPac Inc. here and its former parent company, Hyundai Electronics Industries Co. Ltd. of South Korea, today expanded their ties by announcing a major service and supply agreement for silicon foundry customers.
ChipPac presses ahead with expansion of chip-assembly services
News & Analysis  
1/4/2001   Post a comment
SANTA CLARA, Calif. -- Nearly two years after being spun out of South Korea's Hyundai Electronics Industries Co. Ltd., IC-packaging and testing giant ChipPAC Inc. is plotting a bold new strategy to double its market share by 2005.
Aehr to develop wafer-level burn-in/test systems with U.S. funding
News & Analysis  
1/3/2001   Post a comment
FREMONT, Calif. -- Aehr Test Systems here today announced plans to develop wafer-level burn-in and test systems for production of known good die under a $6.5 million agreement with the U.S. Defense Advanced Research Projects Agency (Darpa).


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