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Content tagged with Test & Measurement
posted in January 2010
Are "RF" and "wireless" defined by their frequency or their media?
RF & Microwave Designline Blog  
1/30/2010   1 comment
Don't let our inherent ambiguity of common engineering terms cause unintentional confusion
Earnings roundup: Qualcomm lowers sales target
News & Analysis  
1/28/2010   Post a comment
More semiconductor firms and suppliers reported quarterly results that surpassed analyst expectations, but No. 1 fabless chip vendor Qualcomm disappointed the market by lowering revenue guidance for the year.
ESC: Saluting the unsung hero of product development
News & Analysis  
1/27/2010   1 comment
Test engineers should get as much credit as product designers, but they don't. Here's to the test engineer, whose daily challenges and strong will make them a valuable addition to the product development cycle.
Byte Paradigm announces PC-controlled logic signal source
Product News  
1/27/2010   Post a comment
Byte Paradigm launched the GP-24100, a PC-controlled USB 2.0 high speed device featuring digital pattern generator and digital data sampling capabilities.
Berkeley, Solido claim faster IC variation analysis
Product News  
1/27/2010   Post a comment
EDA companies Berkeley Design Automation Inc. and Solido Design Automation Inc. have validated a flow for rapid reduction in variation risk in nanometer designs at the transistor level.
3-channel power meter delivers fast measurement over 10 kHz to 40 GHz
Product News  
1/27/2010   Post a comment
AR RF/Microwave Instrumentation has added the PM2003 power meter to its family of high-quality test instruments, offering high-speed measurement capability and a wide dynamic range.
National Instruments' profit slides
News & Analysis  
1/27/2010   Post a comment
National Instruments posted a net income of $2.37 million on revenue of $202 million for the fourth quarter of 2009, the company said.
LG Electronics licenses EVE's emulation platform
News & Analysis  
1/26/2010   Post a comment
LG Electronics Inc. announced it has selected EVE's ZeBu emulation platform for the verification of its high performance, mass-market consumer products.
VC investment fell in 2009, Q4 signals change
News & Analysis  
1/25/2010   Post a comment
Venture capitalists invested $17.7 billion in 2,795 deals in 2009, marking the lowest level of dollar investment since 1997, according to the MoneyTree Report by PricewaterhouseCoopers and the National Venture Capital Association (NVCA), based on data from Thomson Reuters.
Over-the-air Testing of MIMO Mobile Terminals (Part 2 of 3)
Design How-To  
1/25/2010   Post a comment
This white paper discusses the issues related to testing of multiantenna multiple-input, multiple-output mobile terminals
Of Windmills and Recording Studios
Design How-To  
1/20/2010   1 comment
Windmills are cost more than a $1 million often requiring maintenance to go with their size and volatile nature. This article describes machine monitoring systems in wind turbines, how the requirements for a music studio network are similar to a turbine's monitoring system and how Firewire can been used to create a maintenance system for turbines.
Ex-ST exec calls for EDA to take strategic view
News & Analysis  
1/20/2010   Post a comment
When asked if the EDA industry has a roadmap, Joseph Borel, ex-executive vice president in central research and development at STMicroelectronics NV (Switzerland, Geneva), answers affirmatively as Europe continually renews the Medea+ EDA roadmap. The real question should however be: Does the EDA industry need an international roadmap?
Agilent Technologies extends its offering for the characterisation of serial interfaces
Product News  
1/19/2010   Post a comment
Agilent Technologies announced the N4876A 2:1 multiplexer, extending the generator data rate of its J-BERT N4903B and ParBERT 81250A test instruments up to 28Gbit/s.
VeriWave makes MIMO testing moves
News & Analysis  
1/19/2010   Post a comment
VeriWave has reduced test times and cut overall test costs 50-75 percent with its new 3x3 MIMO signal generator.
Over-the-air Testing of MIMO Mobile Terminals (Part 1 of 3)
Design How-To  
1/18/2010   Post a comment
This white paper discusses the issues related to testing of multiantenna multiple-input, multiple-output mobile terminals
Nexus teardown, CES and Intel-FPGA tale, lead weekly story ranking
1/15/2010   Post a comment
Here are the top five online stories for the week beginning Sunday, Jan. 10, as ranked by EE Times readers, up to and including Friday, Jan. 15. The ranking is based on the number of reader "views" or "hits" on a particular article.
Lecroy seeds education and industrial markets with low cost oscilloscopes
Product News  
1/15/2010   Post a comment
LeCroy expanded its low-end WaveAce oscilloscope series to include 4-channel and 40MHz models for simple and efficient debug, with a special discount applying for universities and industrial users.
Mentor speeds USB 2.0 products verification
Product News  
1/14/2010   Post a comment
Mentor Graphics Corp. announced the availability of a hardware-assisted tool that accelerates the verification of USB. 2.0 products.
Test gear firm cuts jobs in wake of acquisitions
News & Analysis  
1/14/2010   Post a comment
Test equipment vendor Ixia plans to cut roughly 80 jobs as part of a restructuring initiative following its acquisitions late last year of Catapult Communications and of Agilent Technologies' N2X data network testing product line.
Japan university to use Agilent ESL software
News & Analysis  
1/14/2010   Post a comment
Yamagata University in Japan announced it has licensed Agilent Technologies' SystemVue ESL software to reduce by up to 30 percent the time required for the design and verification of its communication hysical layer (PHY) system.
VC investment jumped in November 2009, says GSA
News & Analysis  
1/12/2010   Post a comment
Fifteen fabless chip companies and semiconductor suppliers raised $93.5 million in November 2009, according to industry organization the Global Semiconductor Alliance.
Freescale, Mentor renew contract for EDA tools
News & Analysis  
1/11/2010   Post a comment
Freescale Semiconductor Inc. and Mentor Graphics Corp. announced they are partnering on silicon test, yield analysis, physical verification and DFM technology.
Optical spectrum analyzer reduces measurement time by 80 percent, claims Anritsu
Product News  
1/8/2010   Post a comment
The MS9740A optical spectrum analyzer announced by Anritsu Corporation is designed to measure the output characteristics of active optical devices used in optical communications systems.
EU project readies UML/SysML-based HW/SW codesign tool
Product News  
1/6/2010   Post a comment
A first technology solution has emerged from the European Union's Framework7 SATURN project: a UML/SysML-based hardware/software co-design solution based on Artisan Studio, a modeling suite from Artisan Software Tools Ltd. (Cheltenham, England).
Easing the challenge of RF design (Part 1 of 2)
Design How-To  
1/4/2010   Post a comment
Designing in a wireless link need not be a nightmare--if you follow some simple guidelines Parts Search

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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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4:48:30 PM
michigan0 Sang Kim First, 28nm bulk is in volume manufacturing for several years by the major semiconductor companies but not 28nm FDSOI today yet. Why not? Simply because unlike 28nm bulk the LDD(Lightly Doped Drain) to minimize hot carrier generation can't be implemented in 28nm FDSOI. Furthermore, hot carrier reliability becomes worse with scaling, That is the major reason why 28nm FDSOI is not manufacturable today and will not be. Second, how can you suppress the leakage currents from such ultra short 7nm due to the short channel effects? How thin SOI thickness is required to prevent punch-through of un-dopped 7nm FDSOI? Possibly less than 4nm. Depositing such an ultra thin film less then 4nm filum uniformly and reliably over 12" wafers at the manufacturing line is extremely difficult or not even manufacturable. If not manufacturable, the 7nm FDSOI debate is over!Third, what happens when hot carriers are generated near the drain at normal operation of 7nm FDSOI? Electrons go to the positively biased drain with no harm but where the holes to go? The holes can't go to the substrate because of the thin BOX layer. Some holes may become trapped at the BOX layer causing Vt shift. However, the vast majority of holes drift through the the un-dopped SOI channel toward the N+Source,...
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