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posted in November 2001
TEL enhances prober to handle mix of 200- and 300-mm wafers
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11/30/2001   Post a comment
TOKYO -- In a move to increase flexibility and throughput in wafer-test operations, Tokyo Electron Ltd. today announced an enhanced version of its P-12XL prober, which adds a new sort loader, semi-automatic probe card changer, and an improved wide area probe polish feature.
More job and pay cuts at Agilent
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11/19/2001   Post a comment
Agilent Technologies is cutting another 4,000 jobs and enforcing 5% pay reductions on all remaining staff
More job and pay cuts at Agilent
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11/16/2001   Post a comment
Test Trade-Offs at ITC 2001
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11/15/2001   Post a comment
This year's International Test Conference (ITC) focused on test tradeoffs for chip and chip-based systems. Agilent's Rob Aitken, this year's co-chair and ITC 2002's chair, reviews the conference's keynote address along with other pertinent presentations, panels, and papers covering key test issues.
LTX promises to lower the cost of test with new ATE system
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11/13/2001   Post a comment
WESTWOOD, Mass. -- In a move to reduce the cost of test, LTX Corp. here rolled out a new version of its Fusion line of testers. The new Fusion CX from Westwood-based LTX is designed for use in testing analog, mixed-signal, and wireless chips, said Roger W. Blethen, president and chief executive of LTX. "The Fusion CX expands the range of devices, such as Bluetooth and 802.11, that can be tested economically on Fusion," Blethen said.
LTX believes it hit low point for tester orders in last quarter
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11/13/2001   Post a comment
WESTWOOD, Mass.--Automatic test equipment supplier LTX Corp. here today reported a net loss of $9.4 million on sharply lower sales of $33.0 million in the company's fiscal first quarter, ended Oct. 31. LTX's revenues were 66% lower than $98 million in the fiscal quarter last year due to the severe downturn in semiconductor test markets.
Motorola moves wafer-level burn-in/test to high-end processors
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11/12/2001   Post a comment
AUSTIN, Tex. -- Motorola Inc. today announced a major extension of wafer-level burn-in and test processes to include high-performance, flip-chip microprocessors, which can now be offered as bare-die products with the same reliability as packaged devices.
ITC 2001 Emphasizes More Cooperation, Less Test Cost
News & Analysis  
11/8/2001   2 comments
Activities and products at the recent International Test Conference focused on making manufacturing test faster and less expensive. Jim Lipman, TechOnLine's Content Director, discusses ITC's major themes along with some of the show's more interesting product announcements.
Teradyne forms new board-test division after GenRad acquisition
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11/6/2001   Post a comment
BOSTON -- Teradyne Inc. here today announced a new board-test division that combines its own operations with those from its recent acquisition of GenRad Inc. The board-test operation--called the Assembly Test Division--will be headed by Robert M. Dutkowsky. A long-time veteran in the automatic test equipment (ATE) business, Dutkowsky was chairman, president and CEO of GenRad.
Unisys plans big ATE push with burn-in tester for high-end processors
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11/5/2001   Post a comment
CHANDLER, Ariz. -- Unisys Corp. is widely known as a provider of services in the information-technology (IT) sector, but the company also hopes to elevate its status in a surprising arena--automatic test equipment (ATE). Unisys' low-profile ATE unit--dubbed Unisys Unigen Operations (UUO)--here today announced a new burn-in test system that is specifically designed for high-end microprocessors, ASICs and other complex devices.
Credence, ISE Labs form chip-testing service center to lower ATE costs
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11/5/2001   Post a comment
FREMONT, Calif. -- Credence Systems Corp. and International Semiconductor Engineering Laboratories (ISE Labs) here today announced the opening of a new center that will provide low-cost, chip-testing services for IC makers. The Credence Technology Center will provide chip makers with analog, logic, memory, and other chip-testing services. The center will use automatic test equipment (ATE) from Credence of Fremont.
SoC test requirements debated
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11/2/2001   Post a comment
The prevalence and escalating cost of system-on-chip (SoC) designs are forcing a reexamination of existing approaches to design and test, according to EDA and test industry executives at a panel session during this week's International Test Conference.
Credence's DCI unit rolls out test socket to reduce IC costs
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11/2/2001   Post a comment
SANTA CLARA, Calif. -- Dimensions Consulting Inc. (DCI) here rolled out a low-power engineering test socket line for use in prototyping complex ICs. The Model 1560 Thermal Control Socket System is a standalone device that enables the characterization of ICs in substantially less time than traditional forced-air thermal control systems, according to DCI of Santa Clara. DCI is a subsidiary of Credence Systems Corp., a supplier of automatic test equipment (ATE), in Fremont, Calif.
Test Insight rolls out test-generation software that reduces ATE costs
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11/1/2001   Post a comment
BALTIMORE -- During the International Test Conference (ITC) here, Test Insight Ltd. here rolled out a line of software that promises to reduce the costs of chip-testing for IC makers. The first product is a new release of its test-program generation software line--dubbed Wave Wizard. This product generates test patterns in automated test equipment (ATE) from Verilog simulation environments. It also verifies and debugs IC test patterns and timing using a tester behavioral model.

As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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