Aeroflex IPO raises $232 million News & Analysis 11/22/2010 2 comments Aeroflex Holding Corp. priced its initial public offering of 17,250,000 shares of common stock at a price to the public of $13.50 per share last week. The company granted the underwriters a 30-day option to purchase up to an additional 2,587,500 shares at a 6.25 percent discount.
Validate electronics robustness: Part 2—Find the worst case Design How-To 11/19/2010 8 comments Ensuring that today’s complex electronic systems meet specific quality, robustness, lifespan, and safety goals requires validating that the system implementation matches the specification. An important step in verification is to gain an accurate understanding of the system’s worst-case behavior.
Test instrumentation for wireless network installation and maintenance Design How-To 11/17/2010 Post a comment Measurement and fine adjustment of two-port devices such as cavity filters, combiners, multiplexers, etc., (which are needed to mitigate co-location issues and allow systems to meet emission compliance standards) are tasks best done on-site, and often need to be completed in challenging environments, such as inside confined transceiver bays, near active flightlines, and on elevated perches on antenna towers.
New challenges for LTE and MIMO receiver test Design How-To 11/17/2010 1 comment Release 8 of the 3GPP specifications, which defines the Long Term Evolution (LTE) towards 4th generation systems, includes new requirements for spatial multiplexing — also referred to as Multiple Input Multiple Output ( MIMO) — wherein the base station and UE communicate using two or more spatial streams. As a result of the increasing data rates and flexibility, the design and test of LTE systems differs in many ways from previous generations of cellular technology. In particular, LTE receiver
MIPI M-PHY takes center stage Design How-To 11/14/2010 Post a comment The curtain is up and the M-PHY specification is taking center stage, positioned to handle the many different roles required for a faster, more reliable, physical interface layer (PHY Layer) on mobile devices.
New test requirements for 40/100 GbE transceivers Design How-To 11/10/2010 Post a comment Strong user demand is ahead of the development of the latest high speed Ethernet standards. While the physical layer test requirements for the new 40/100 GbE standard have evolved from previous generations, there are a number of new requirements that must be addressed to ensure performance and interoperability. In this article, we will review the updated optical and electrical measurements and testing approaches for this rapidly evolving field.
Mentor and ARM link for memory test News & Analysis 11/3/2010 Post a comment Mentor Graphics Corp. is working with ARM to provide an automated memory test and repair solution for ARM embedded memories and processor cores. Interoperability has been established between Mentor Graphics Corp.’s Tessent memory test and repair solution and ARM’s family of cores and embedded memory IP.
In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.