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posted in November 2010
Intersil Li-ion battery manager IC ensures performance and safety
Product News  
11/30/2010   Post a comment
Device emphasizes accuracy, diagnostics, and robust communication.
Active balancing boosts HEV/EV Li-ion battery utilization: Part 2—Methods
Design How-To  
11/29/2010   5 comments
Popular active balancing methods are reviewed and details given of a unique active cell balancing battery management system.
Active balancing boosts HEV/EV Li-ion battery utilization: Part 1—Range anxiety alleviated
Design How-To  
11/29/2010   Post a comment
Passive balancing has dominated Li-ion battery packs in the past. Economic pressures are forcing automotive OEMs to choose more advanced, active balancing systems to squeeze out every drop of energy from the battery pack to mitigate range anxiety.
Aeroflex IPO raises $232 million
News & Analysis  
11/22/2010   2 comments
Aeroflex Holding Corp. priced its initial public offering of 17,250,000 shares of common stock at a price to the public of $13.50 per share last week. The company granted the underwriters a 30-day option to purchase up to an additional 2,587,500 shares at a 6.25 percent discount.
Validate electronics robustness: Part 2—Find the worst case
Design How-To  
11/19/2010   8 comments
Ensuring that today’s complex electronic systems meet specific quality, robustness, lifespan, and safety goals requires validating that the system implementation matches the specification. An important step in verification is to gain an accurate understanding of the system’s worst-case behavior.
Test instrumentation for wireless network installation and maintenance
Design How-To  
11/17/2010   Post a comment
Measurement and fine adjustment of two-port devices such as cavity filters, combiners, multiplexers, etc., (which are needed to mitigate co-location issues and allow systems to meet emission compliance standards) are tasks best done on-site, and often need to be completed in challenging environments, such as inside confined transceiver bays, near active flightlines, and on elevated perches on antenna towers.
New challenges for LTE and MIMO receiver test
Design How-To  
11/17/2010   1 comment
Release 8 of the 3GPP specifications, which defines the Long Term Evolution (LTE) towards 4th generation systems, includes new requirements for spatial multiplexing — also referred to as Multiple Input Multiple Output ( MIMO) — wherein the base station and UE communicate using two or more spatial streams. As a result of the increasing data rates and flexibility, the design and test of LTE systems differs in many ways from previous generations of cellular technology. In particular, LTE receiver
MIPI M-PHY takes center stage
Design How-To  
11/14/2010   Post a comment
The curtain is up and the M-PHY specification is taking center stage, positioned to handle the many different roles required for a faster, more reliable, physical interface layer (PHY Layer) on mobile devices.
Plessey signs to make 'disruptive' sensor
News & Analysis  
11/11/2010   7 comments
An electric potential sensor that promises to be highly disruptive in multiple markets is set to be manufactured and commercialized by Plessey Semiconductors Ltd.
New test requirements for 40/100 GbE transceivers
Design How-To  
11/10/2010   Post a comment
Strong user demand is ahead of the development of the latest high speed Ethernet standards. While the physical layer test requirements for the new 40/100 GbE standard have evolved from previous generations, there are a number of new requirements that must be addressed to ensure performance and interoperability. In this article, we will review the updated optical and electrical measurements and testing approaches for this rapidly evolving field.
Voice service with LTE: Can you still hear me now?
RF & Microwave Designline Blog  
11/4/2010   1 comment
There’s a lot of speculation and misinformation regarding how voice service will be delivered once LTE is deployed on a large scale.
Is it time to get rid of Daylight Savings Time?
Blog  
11/4/2010   74 comments
Is "changing clocks" a useless holdover from a very different era?
Mentor and ARM link for memory test
News & Analysis  
11/3/2010   Post a comment
Mentor Graphics Corp. is working with ARM to provide an automated memory test and repair solution for ARM embedded memories and processor cores. Interoperability has been established between Mentor Graphics Corp.’s Tessent memory test and repair solution and ARM’s family of cores and embedded memory IP.


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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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