Amkor, Toshiba agree to start chip-assembly venture on Jan. 1 News & Analysis 12/12/2000 Post a comment CHANDLER, Ariz.--Amkor Technology Inc. and Toshiba Corp. today announced a final agreement in their plans to set up a joint venture for semiconductor assembly and test in Japan. The venture will be called Amkor Iwate Co. Ltd., and it will begin operations on Jan. 1 at the Iwate Toshiba Electronics Co. Ltd. site, near Kitakami.
Kulicke & Soffa form test unit after acquisitions News & Analysis 12/12/2000 Post a comment WILLOW GROVE, Pa. -- The semiconductor test world added another player today when Kulicke & Soffa Industries Inc. here said it has formed a Test Division following the completion of its purchase of privately-held Probe Technology Corp., a Santa Clara, Calif.-based manufacturer of probe cards, for about $65 million in cash (see Nov. 14 story).
Agilent to acquire RF-component test systems house News & Analysis 12/7/2000 Post a comment PALO ALTO, Calif. -- Agilent Technologies Inc. today announced an agreement to buy ATN Microwave Inc., a 16-year-old developer of test systems for radio-frequency components used in high-speed data communications. Terms of the purchase were not released.
STMicro doubling size of chip-assembly plant in China, says CEO News & Analysis 12/6/2000 Post a comment TOKYO -- STMicroelectronics is expanding its chip-packing operations in China ahead of the country's business reforms related to its entry into the World Trade Organization, said Pasquale Pistorio, president and chief executive officer of the European chip maker. Interviewed at the Semicon Japan trade show here today, Pistorio said STMicroelectronics is now doubling the size of its assembly and test operation in Shenzhen for consumer electronics and telecommunications chips.
SEMICON JAPAN: Optimistic chip equipment suppliers expect 22% growth in 2001 News & Analysis 12/6/2000 Post a comment TOKYO -- A new consensus forecast from suppliers of chip-making equipment and materials shows spending on semiconductor capacity growing 22.3% to $57.2 billion in 2001 after an 83.4% increase to $46.7 billion in 2000. The forecast, released during this week's Semicon Japan trade show here, shows worldwide suppliers are still optimistic about 2001 despite new projections by some analysts, who have cut their growth estimates below 10% next year.
Infineon plans 300-mm wafer-level packaging of DRAMs with FormFactor's MicroSpring News & Analysis 12/5/2000 Post a comment LIVERMORE, Calif.--FormFactor Inc. today announced its has licensed its MicroSpring contact technology for chip testing and wafer-level packaging to Infineon Technologies AG, which has also agreed to invest $5 million in the Livermore-based startup. Munich-based Infineon said it plans to use the MicroSpring technology to simplify backend testing and assembly of DRAMs from 300-mm diameter wafers.
Chip-equipment market headed for 'recession' in 2001, says VLSI Research News & Analysis 12/1/2000 Post a comment SAN JOSE -- In yet another ominous sign for the semiconductor industry, the chip-equipment market is headed for a gradual slowdown in 2001--with a possible "recession" in the second half of next year, according to analysts at VLSI Research Inc. here.
In a new forecast, VLSI Research projects that the worldwide semiconductor equipment market will grow at a modest 9.9% rate next year, from $62.7 billion in 2000, to $68.9 billion in 2001.
Blog Make a Frequency Plan Tom Burke 17 comments When designing a printed circuit board, you should develop a frequency plan, something that can be easily overlooked. A frequency plan should be one of your first steps ...