High temperature effects on wafer test probing processes Design How-To 2/29/2012 Post a comment Automated probe mark analysis replaces time-consuming manual analysis, delivering statistically valid quantitative data in an easy-to-interpret format in minimal time. It enables the test engineer to rapidly assess the probing process, identify and analyze issues within the process and define solution options.
Industry considers counterfeit risk analysis tool Blog 2/17/2012 11 comments Obsolescence, market shortages and price hikes are the key motivational factors for counterfeiters to target a part and make a quick buck, according to data compiled by electronic components database firm SiliconExpert Technologies.
Eight-channel RF measurement broadens LTE analysis Product News 2/15/2012 Post a comment Agilent Technologies Inc. has enhanced its N7109A multi-channel signal analyzer for emerging multichannel LTE, LTE-Advanced and MIMO RF measurement requirements, including LTE antenna beam forming and LTE-Advanced carrier aggregation.
Bridging software and hardware to accelerate SoC validation Design How-To 2/15/2012 2 comments As the complexity of systems-on-chip (SoCs) continues to increase, it is no longer possible to ignore the challenges caused by the convergence of software and hardware development. To deliver increased integration within a reasonable cost and time, the industry must transition to a new approach – design for visibility.
Counterfeit parts putting military at risk News & Analysis 2/15/2012 18 comments Counterfeit parts are increasingly finding their way into mission critical military and healthcare equipment, with the number of fake electronic parts soaring dramatically over the past couple of years, according to market research organization IHS iSuppli.
Software tools ease AUTOSAR compliance Design How-To 2/9/2012 Post a comment The AUTOSAR initiative is tackling the industry-wide constraints of complexity, competition, and cost. AUTOSAR provides incentives for manufacturers to replace their proprietary software/hardware interfaces with standardized ones linked to an independent architectural layer.
Challenges of testing mobile memories Design How-To 2/8/2012 1 comment I recently spoke with Cecil Ho, President of CST, about the challenges of testing mobile memories, and he gave me his perspective from his vantage point at CST.
Brief history of scopes Blog 2/8/2012 1 comment I have been serving as interim editor over at scope junction and wanted to share a little bit of history that I dug up on the oscilloscope.
Nostalgic about HP test equipment Engineering Pop Culture! 2/7/2012 29 comments Any electronics engineer or technical person you speak to will know about Hewlett-Packard (HP) test equipment. And many of them will talk nostalgically of a certain item they have owned or worked with. I’m certainly like that.
Intel terahertz supplier secures $5.5 million in funds News & Analysis 2/6/2012 1 comment TeraView Ltd. (Cambridge, England), a startup company founded in 2001 to develop terahertz systems for imaging and spectroscopy, has announced it has secured $5.5 million of investment from a consortium of U.S., Asian and European institutional and corporate investors.
CEA-Leti opens 3-D IC packaging service News & Analysis 2/1/2012 Post a comment French research institute CEA-Leti has announced the launch of a 3-D packaging platform and service that provides industrial and academic partners with what it describes as a "mature" process for the production of 3-D interconnected products and projects.
Aeroflex upgrades digital radio test set Product News 2/1/2012 Post a comment Aeroflex Incorporated announced that an upgrade to its 3920 Radio Test Set supports P25 Phase II TDMA test functions and adds features for the development, manufacturing, and field test of both analog and digital private mobile radios (PMRs) and base stations.