Agilent to cut 2,700 jobs in restructuring News & Analysis 3/26/2009 Post a comment Agilent Technologies plans to cut about 2,700 jobs--roughly 14 percent of its workforce--as part of a major restructuring in its Electronic Measurement and Semiconductor & Board Test segments which will include new leadership.
Cobham reorganizes design and test activities News & Analysis 3/24/2009 Post a comment British defense, aerospace and sub-assembly group Cobham plc is bringing together three of its design, development and testing businesses, Vector Fields, ERA Technology and Culham Lightning, under a new operating company dubbed Cobham Technical Services.
Yokogawa : New models expand applications for OTDR family Product News 3/24/2009 Post a comment Six models have been added to the Yokogawa AQ7275 Series of optical time-domain reflectometers (OTDRs), extending its range of applications to cover virtually all metro, access and core networks as well as FTTH (fibre to the home) and PONs (passive optical networks).
Adva demos 100G serial modulation scheme News & Analysis 3/23/2009 Post a comment Researchers at Adva Optical Networking (Martinsried/Munich, Germany) have .demonstrated a ten-fold increase in system capacity over existing metro DWDM systems using traditional techniques, with an in-house developed DPSK-3ASK (Differential Phase-Shift Keying, 3-level Amplitude-Shift Keying) modulation format for serial 100Gbit/s transmission over a single wavelength channel.
LeCroy expands WaveSurfer oscilloscope line Product News 3/23/2009 Post a comment LeCroy has introduced a line of WaveSurfer Xs-A and MXs-A digital oscilloscopes that offers faster processing, a more responsive user interface, 5 Mpts/ch memory and LXI compliance in bandwidths from 200 MHz to 1 GHz.
IEEE, conference drive smart grids News & Analysis 3/19/2009 Post a comment The IEEE formally approved a new group that will scope out standards for smart grids, and a separate set of stakeholders announced plans for a conference to guide federal investments in the area.
Japan suffers lowest ever chip equipment book-to-bill News & Analysis 3/18/2009 Post a comment The global book-to-bill ratio for Japanese semiconductor manufacturing equipment dropped to 0.35 in February the lowest figure on record, according to a Dow Jones report which gave the Semiconductor Equipment Association of Japan as its source.
Measuring 3-port mixed-mode S-parameters Design How-To 3/18/2009 Post a comment Understand how to measure these critical parameters of a balun (balanced/unbalanced), which provides a transition between a single-ended unbalanced signal and a differential, balanced signal
Tire pressure monitors to reduce CO2 emissons News & Analysis 3/10/2009 2 comments The European Parliament Tuesday (March 10) passed a proposal that will make tire pressure sensors for new cars mandatory. The industry is prepared to offer the technology required but new developments enhance the scope of options.
Fanfare integrates with Agilent comms test Product News 3/9/2009 Post a comment Automated test solutions vendor Fanfare is extending its partnership with Agilent Technologies to offer joint customers the ability to integrate their test assets while automating complex system testing.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.