Trio plan chip packaging joint venture News & Analysis 4/28/2009 Post a comment The consolidation in the semiconductor market is set to continue as Toshiba Corp. plans to create a joint venture in Japan with two packaging groups, Amkor Technology and Nakaya Microdevices, in a bid to cut costs.
Ensuring LBS User Satisfaction: Testing GPS over the Air Design How-To 4/27/2009 Post a comment The Location-Based Services (LBS) market is heating up. Applications that use awareness of the end-user's location have moved beyond the early-adopter crowd and are now being used by a substantial portion of the cellular subscriber base. As a result, there is a significant revenue opportunity from this market and large investments are being made in LBS deployments.
No single panacea in automotive world Automotive DesignLine Blog 4/16/2009 Post a comment While HEV and electric drive concepts dominate the headlines, there are other approaches pursuing the same goal of better fuel efficiency and lower emissions. In all of them, electronics plays a major role.
Meeting the challenges of wireless communications test Design How-To 4/16/2009 Post a comment The market demand for wireless communications continues to accelerate along with the shift to data intensive applications such as web surfing and video. Consumers are expecting higher wireless bandwidths and service providers want to sell value added services beyond voice.
Can you afford to cut the cost of PCB electrical safety test? News & Analysis 4/15/2009 Post a comment All manufacturers and designers of electrically operated products have an obligation to ensure that their equipment functions in a correct and safe fashion, meeting quality and performance standards and, ultimately, living up to the expectations of customers. This applies to PCBs, where the need for testing by manufacturers who use populated boards in their products is clearly paramount.
TTTech, NASA team on TTEthernet for space apps News & Analysis 4/14/2009 Post a comment Realtime networking specialist TTTech Computertechnik AG (Vienna, Austria), which focuses on time-triggered technology, has teamed with NASA to support the space agency's work on and need for dependable integrated embedded systems.
Research team reports breakthrough in optical silicon communication News & Analysis 4/14/2009 Post a comment Transmission speeds beyond 100 Gbit/s based solely on silicon devices have become possible through the efforts of an American-European research group. In particular telecommunications industries are possible beneficiaries. The researchers believe they have paved a promising way to handle the increasing global data traffic.
Thinking Optics vs RF RF & Microwave Designline Blog 4/11/2009 1 comment Don't waste you time at the supermarket checkout line looking at the celebrity publications; instead, exercise your brain with some semi-philosophical thought questions
Siemens picks ADI Blackfin for smart power meters Product News 4/7/2009 Post a comment As part of its 'Smart Grid' infrastructure concept, Siemens is currently developing smart power meters for global markets. As core element for its smart power meters, the company has selected the Blackfin Digital Signal Processor from Analog Devices
National Instruments introduces industrial controller with Intel Core Duo processor Product News 4/6/2009 Post a comment The newest controller from National Instruments--the NI 3110--features an Intel SL9JT L2400 1.66 GHz Core Duo processor, similar to the devices found in many home computers or laptops. With this industrial controller, engineers have a control system for multithreaded applications that require dual-core processing and analysis. Engineers can use this industrial controller as an interface to control remote I/O with hardware such as NI CompactDAQ, NI PXI and NIplug-and-play PCI and PCI Express devi
TI '6743 DSP combines fixed and floating point with connectivity Product News 4/6/2009 Post a comment The TMS320C6743 DSP from Texas Instruments brings floating-point precision and fixed-point performance to energy-efficient, connected applications, all within a single DSP that combines integrated EMAC, increased on-chip memory and offers 100 percent code compatibility with TI's TMS320C6000 devices.