Multicore not up to snuff for basestations News & Analysis 4/27/2010 Post a comment Multicore processors should be ideal for wireless base stations, but so far both the chips and their tools fall short of meeting engineers needs, according to a senior developer at HuaWei speaking at the Multicore Expo.
Maximizing the value of your IP Design How-To 4/23/2010 Post a comment There is no doubt that leveraging IP for reuse is here to stay. The economic and time-to-market advantages are too enormous to forego. However, there are serious challenges to overcome given the high cost of verification and the risk of collateral design damage consequential to RTL modification.
Low-k test regime spots defects on wafers News & Analysis 4/19/2010 Post a comment In a low-k dielectric test regime being developed for Semiconductor Research Corp. members, Columbia University is perfecting an approach that will measure the average number of density traps in a low-k material to spot potential failures while the chips are still on the wafer.
Addressing non-linear models with appropriate tools Design How-To 4/16/2010 Post a comment This white paper entitled "X-parameters and Beyond, AWR's Support of PHD and Nonlinear Behavioral Models," provides details on rapidly-emerging nonlinear models and measurement systems and how Thye are employed in AWR's Microwave Office high-frequency design software.
India, Arizona chip test firms agree to merge News & Analysis 4/12/2010 Post a comment Semiconductor test services companies Tessolve Services Pvt. Ltd. (Bangalore, India) and Dynamic Test Solutions Inc. (Chandler, Ariz.) have announced that they have signed a definitive agreement to merge the two companies.
Is EDA innovating enough? Blog 4/9/2010 5 comments Much has been written and said about the travails of the EDA industry. Some industry leaders are shrinking in size and losing money. The industry as a whole is not growing and prospects are not promising. Part of the problem can be explained by the fact that we are just coming out of one of the worst recessions in history that has impacted most industries. Yet, most observers agree that the industry's struggles can't be explained by the economy alone.
Automotive still a solid opportunity for EDA, says Mentor exec News & Analysis 4/8/2010 1 comment As EDA searches for opportunities to generate more revenues from outside the semiconductor industry, Martin O'Brien, general manager, Integrated Electrical Systems Division of Mentor Graphics Corp., highlighted automotive and said the trend is likely to continue with the advent of hybrid and electric vehicles.
Nano ePrint licenses Infiniscale's modeling tool News & Analysis 4/6/2010 Post a comment Nano ePrint Ltd., a spin off from the University of Manchester in England, announced it has selected the GreenLys modeling tool suite from French EDA startup Infiniscale SA for its organic electronic devices modeling needs.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.