Micronova shrinks HiL simulator to desktop size
Product News 7/30/2009 Post a comment
With the NovaSim Micro, test devices vendor Micronova (Vierkirchen, Germany) has shrunk Hardware-in-the-loop (HiL) simulators to desktop size. Despite its small size, the simulator runs function tests on complex ECUs, the vendor promises.
Agilent to pay $1.5B for Varian
News & Analysis 7/27/2009 1 comment
Agilent Technologies Inc. has agreed to pay $1.5 billion for Varian Inc. as it continues to seek growth opportunities outside of its dominant position in the electronic test and measurement equipment market.
What's in your lab?
RF & Microwave Designline Blog 7/25/2009 Post a comment
The electronics lab and test bench is a very different place than many places with the same name
Continental integrates yaw rate and acceleration sensors in one unit
Product News 7/23/2009 1 comment
Automotive tier one Continental AG has combined yaw rate and acceleration sensors in one component. The device aims at ESC and other safety-related systems, offering compact design at lower cost. Unlike comparable sensors, it is not based on MEMS technology but implemented as capacitive sensors.
How to design a low power wireless sensor network
Design How-To 7/17/2009 Post a comment
Driven by the demand for "green" technology and better use of power, a new generation of extreme low power wireless networks is being developed for use in machine to machine networks. With this in mind, a new approach towards truly wireless networks is needed.
PCI Express will scale to 8 GHz by next June
News & Analysis 7/15/2009 1 comment
The final specification for PCI Express 3.0 will be released by next June, the PCI Special Interest Group announced at its annual conference, providing more detail about the 8 GHz interconnect and challenges implementing it.
A holistic approach to addressing the hot component issue
Design How-To 7/14/2009 Post a comment
As service providers strive to meet growing government demands for "green" compliance, as well as their own financial desire to reduce operating expenses, the problem of heat dissipation has developed into a hot button issue amongst the semiconductor industry in addressing these concerns. This design article from TI takes a look at some holistic solutions to this dilemma.
RF links come home
Blog 7/11/2009 4 comments
Even simple wired links in the home are succumbing to the lure and benefits of basic RF connectivity
Agilent broadens USB test portfolio
Product News 7/8/2009 Post a comment
Agilent's portfolio now includes an integrated USB 3.0 protocol analysis solution, which results from a collaboration with Ellisys, and the recently introduced Infiniium 9000 Series mixed signal oscilloscope, which includes fast, integrated 2GSa/s digital channels and an in-scope protocol viewer for USB.
Startup touts major advance in wireless sensor's temp sensitivity
News & Analysis 7/6/2009 Post a comment
A start-up based in Cambridge, England, focusing on healthcare technologies, has started user trials of a wireless temperature sensor that can measure body temperature to within a thousandth of a degree. Cambridge Temperature Concepts (CTC) has already used the sensor to create a device to assist women in getting pregnant.