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posted in September 2000
Agilent announces new memory tester
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9/29/2000   Post a comment
PALO ALTO, Calif.-- Agilent Technologies Inc. here has expanded its line of automatic test equipment, rolling out a system for use in testing high-speed non-volatile memory devices. Featuring a tester-per-site architecture, the V4400 NVM Test System from Agilent is a general-purpose wafer-sort and final test system designed for use in testing non-volatile memories, embedded devices, and specialty ICs.
Schlumberger test handler cuts costs with new thermal control technology
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9/25/2000   Post a comment
SAN JOSE -- Schlumberger Ltd.'s Test & Transactions division today announced a new semiconductor test handler that enables IC testing at multiple temperature settings with a single insertion of devices into systems. The company said its new single-insertion, multi-temperature (SIM-T) handler addresses a growing need for higher reliability of chips.
STATS claims improvements in test-handler throughput
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9/20/2000   Post a comment
SINGAPORE -- ST Assembly Test Services Ltd. today announced a patent for enhancements to test handlers, which enable robotic arms to pick up ICs with greater accuracy and reduce the set-up times inside test chambers.
Hyundai licenses FormFactor's MicroSpring for DRAM wafer-level packaging
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9/18/2000   Post a comment
LIVERMORE, Calif. -- Aiming to revolutionize the way ICs are tested and assembled in chip packages, FormFactor Inc. here today announced its first technology licensing pact with a major DRAM maker--Hyundai Electronics Industries Co. Ltd.--which plans to use the company's MicroSpring contacts on processed wafers to lower costs and boost yields in backend manufacturing steps. Seven-year-old FormFactor claims to be the only company to offer a complete wafer-level packaging and testing solution that
Surge in tester orders, part shortages stretch delivery times in Taiwan
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9/15/2000   Post a comment
TAIPEI, Taiwan -- At the Semicon Taiwan trade show here, suppliers of automatic test equipment claim they are now scrambling to expand production to keep up with a surge in demand for chip testers--especially from an emerging crop of test subcontractors on the island.
Lucent announces suppliers of substrates, testers for Bluetooth products
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9/13/2000   Post a comment
ALLENTOWN, Pa. -- Lucent Technologies Inc.'s Microelectronics Group here today announced it will use ceramic substrates from CTS Corp. and test equipment from LTX Corp. to ramp volume production of Bluetooth chips for wireless-connection applications.
Teradyne will spin off test software in new company
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9/6/2000   Post a comment
BOSTON -- Teradyne Inc. today announced it will transfer acquired test software operations to a new company, called Empirix, which will be owned by employees, an investor group, and Teradyne. The move will enable Teradyne to concentrate on its core test equipment and interconnection businesses, said Geroge Chamillard, chairman and CEO of the Boston-based company.
Schlumberger offers prober for 0.18-micron flip-chip analysis
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9/6/2000   Post a comment
SAN JOSE -- Schlumberger Ltd.'s automatic test equipment unit here today rolled out a new laser-probe system for flip-chip design verification and failure analysis. The IDS 2500 system uses phase interforemeter detector (PID) technology to speed access to critical waveforms that IC designers and product development engineers need to debug advanced flip-chip logic devices.
Chip-testing houses struggle to get new ATE systems
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9/1/2000   Post a comment
SAN JOSE -- Faced with expanding lead times for delivery of new chip testers and explosive growth in outsourcing of manufacturing steps, independent test subcontractors say they are now suffering from a capacity crunch and having a hard time keeping up with demand. Several leading test subcontractors cite an unexpected surge in business. In some cases, these companies say they are now turning away new customers in order to handle the growing volumes at existing accounts.
Agilent acquires test IP supplier for network systems applications
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9/1/2000   Post a comment
PALO ALTO, Calif. -- Agilent Technologies Inc. today announced it has completed a previously announced acquisition of privately-held Digital Technology Inc., which supplied intellectual property (IP) for testing of network systems. The spin-off from Hewlett-Packard Co. did not release financial terms of the acquisition. Parts Search

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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
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