Fake components delay designs in Israel News & Analysis 3/29/2007 Post a comment Fake components are delaying several design projects in Israel. According to sources who spoke with EETimes Europe , the fake components, mostly from China, will lead to lost sales at several companies due to the delays.
Parker acquires French EMI shields maker News & Analysis 3/28/2007 Post a comment Parker Hannifin Corp., which owns Chomerics in Europe, has bought, for an undisclosed sum, French electromagnetic interference shielding and thermal management device specialist Acofab SAS and its majority shareholder Adecem SARL.
Accurate Thermal Analysis of Chip/Package Systems Design How-To 3/15/2007 Post a comment With the increasing complexity and power dissipation of modern electronic designs, controlling peak temperature and predicting the temperature profile on the chip early in the process is becoming critical for insuring system reliability. Low power design methodologies create their own thermal challenges, as they may generate "hot" and "cool" regions on the chip. Causes and soutions are explored.
Reed relays switch up to 1 GHz Product News 3/2/2007 Post a comment MEDER electronic has introduced a family of miniature SIL reed relays capable of switching up to 1 GHz. These devices target ATE systems, measurement equipment, computer peripherals, and alarm systems.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.