Fake components delay designs in Israel News & Analysis 3/29/2007 Post a comment Fake components are delaying several design projects in Israel. According to sources who spoke with EETimes Europe , the fake components, mostly from China, will lead to lost sales at several companies due to the delays.
Parker acquires French EMI shields maker News & Analysis 3/28/2007 Post a comment Parker Hannifin Corp., which owns Chomerics in Europe, has bought, for an undisclosed sum, French electromagnetic interference shielding and thermal management device specialist Acofab SAS and its majority shareholder Adecem SARL.
Accurate Thermal Analysis of Chip/Package Systems Design How-To 3/15/2007 Post a comment With the increasing complexity and power dissipation of modern electronic designs, controlling peak temperature and predicting the temperature profile on the chip early in the process is becoming critical for insuring system reliability. Low power design methodologies create their own thermal challenges, as they may generate "hot" and "cool" regions on the chip. Causes and soutions are explored.
Reed relays switch up to 1 GHz Product News 3/2/2007 Post a comment MEDER electronic has introduced a family of miniature SIL reed relays capable of switching up to 1 GHz. These devices target ATE systems, measurement equipment, computer peripherals, and alarm systems.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.