Computer products boost Arrow's 1Q News & Analysis 4/24/2007 Post a comment Arrow Electronics Inc. reported sales of computer products grew 33 percent in the first quarter of 2007 and hoisted the distributor's overall sales and profits to record levels for the period that ended in March.
IC coolers offer low profile Product News 4/20/2007 Post a comment JARO Thermal has introduced a series of light-weight, open-fin IC coolers for low-profile applications. The V6X090 coolers are packaged in a compact 70 (W) x 58 (L) x 12 (H)-mm footprint.
Dual-action tact switch is sealed Product News 4/17/2007 Post a comment E-Switch has introduced a low-current, dual-action tact switch. The sealed TL3350 device offers a low profile, which makes it suitable for a variety of consumer, computer, instrumentation, telecommunications and industrial applications.
Tactile switches offer square stem Product News 4/12/2007 Post a comment The BI Technologies Electronic Components Division of TT electronics expanded their tactile switch product offering to include a series of devices with a square stem, designated the SWT8 series; and added three additional styles to the sealed product offering, designated the SWTW Series.
SSOP MOSFET relays cut board space by 67% Product News 4/10/2007 Post a comment With the medical sector in mind, Omron packaged its latest series of MOSFET relays in an SSOP that measures 1.8H x 2.W x 3.8Lmm to yield board-space savings of 67% when compared to a standard SOP package.
Low-profile relay takes heat away from PCBs Product News 4/9/2007 Post a comment Omron Electronic Components LLC released the G2RL-1ATP series of power PCB relays featuring 0.250 inch external, quick-connect-contact load terminals. The use of quick-connect terminals allows the load current to be directly routed through the relay's contacts, eliminating the need for large PCB traces.
IR hit by accounting snafu News & Analysis 4/9/2007 Post a comment International Rectifier said it will delay filing its quarterly report after discovering accounting irregularities at a foreign subsidiary.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.