IMEC, Atrenta to show 3-D design flow at DAC Product News 5/24/2011 3 comments EDA company Atrenta Inc., working with the IMEC research institute on a 3-D integration project, has developed a planning and partitioning design flow for heterogeneous 3-D stacked IC assemblies. They plan to demo the flow at the DAC exhibition.
MOST150 optimizes data bus efficiency Design How-To 5/9/2011 Post a comment The MOST150 infotainment bus system is about to take the place of earlier MOST systems. With its high bandwidth which can be utilized up to nearly 100%, MOST150 is a viable platform for advanced next-gen infotainment systems. Daimler already has gathered experience with the new bus.
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.