Magnetic superpower on the rise News & Analysis 9/29/2009 1 comment At the 10th Cambridge Enterprise Conference, at the end of September, a number of startups showed up to exhibit what could be the next wave of technology to penetrate our everyday lives. Magnifye Ltd was one of them.
Hammond offers die-cast enclosures in sixteen standard sizes News & Analysis 9/18/2009 Post a comment Hammond Electronics has launched an initial six sizes in its 1550 family, a range of industry standard sizes small die-cast aluminium enclosures that provide robust mechanical protection and good EMC attenuation levels, making them suitable for a use in a wide variety of applications.
Verotec : 1U fan trays feature intelligent control Product News 9/17/2009 Post a comment Designed to provide localised cooling of 19 inch rack mounted or desktop equipment, a range of 19 inch 1U standard fan trays from Verotec consists of two depths, a 250 mm deep unit fitted with three fans and a 350 mm deep unit with six fans, fitted with either a 3 mm thick silver anodised aluminium or a 3 mm black powder coated steel front panel.
Schroff : AdvancedMC modules meet MicroTCA.1 spec Design How-To 9/7/2009 Post a comment Electronics packaging specialist Schroff has developed a retention device for securely fastening AdvancedMC modules into a MicroTCA subrack to enable such systems to withstand the extreme shock and vibration conditions laid down in the recently issued MicroTCA.1 specification.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.