Embedded Systems Conference
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Content tagged with Electromechanical
posted in September 2012
Tiny enclosures fit in mobile devices
Product News  
9/28/2012   Post a comment
TEKO is offering enclosures that are the size of a credit card, but deep enough to accept a PCB populated with surface-mount components.
FCI’s first USB 3.0 connector debuts
Product News  
9/13/2012   Post a comment
FCI has released a SuperSpeed USB 3.0 connector that minimizes user-wait time by supporting a 5 Gbps data rate and providing a faster sync time, which is a 10x performance increase versus USB 2.0 connectors.
Startup QBotix automates solar farms with robots
Design How-To  
9/4/2012   3 comments
Taking a separate track to greater solar efficiency, QBotix is leveraging robotics to reduce the cost of operating solar farms while increasing energy production.
Sensor fusion and MEMS for 10-DoF solutions
Design How-To  
9/3/2012   3 comments
The basic aspects of sensor fusion are described with an emphasis on 10-degrees-of-freedom solutions and their application in markets such as health care.


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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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