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Content tagged with Optoelectronic
posted in January 2002
Isonics ships thick-film SOI wafers for optical MEMS applications
News & Analysis  
1/29/2002   Post a comment
GOLDEN, Colo.-- As planned several weeks ago, Isonics Corp. today announced it has begun shipping thick-film silicon-on-insulator (SOI) wafers. The Colorado company accelerated its entry into the SOI wafer market by striking an alliance with Silicon Quest International Inc. of Santa Clara, Calif. (see Jan. 8 story).
A Reusable Fiber-Chip Coupling Method for Optical-Communication Transmitter Modules
Design How-To  
1/25/2002   Post a comment
U.H.P. Fischer of Berlin's Heinrich-Hertz Institute describes a low-cost technique for high-efficiency coupling of optical fiber to a laser diode.
Photonics chip firm goes for outsourced substrates
News & Analysis  
1/4/2002   Post a comment
Intense Photonics, based in High Blantyre, Scotland, has cut a deal with Cardiff-based IQE that will see the Welsh III-V wafer maker produce specially grown wafers for Intense's quantum well intermixing (QWI) optoelectronics process.


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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
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