Breaking News
Content tagged with Passive
Page 1 / 2   >   >>
Freescale, with Solid Q2 Growth, Milks Auto IC Boom
News & Analysis  
7/25/2014   3 comments
Revenues of Freescale’s five key product groups grew across the board by double digits during the first half of 2014. Freescale’s CEO said, “We are growing our business at twice the speed of the market.”
Design Cars Like Planes, Use Them Like Cellphones
News & Analysis  
6/4/2014   6 comments
A Ford executive cautioned that, without tools that keep up with the automotive design challenges, a car's complexity will just keep growing. No longer will consumers be able to say: "It just works."
Power Week: Toyota Develops SiC Transistor, Structural Supercap & More
News & Analysis  
5/22/2014   1 comment
Toyota unveils an in-house-developed SiC power semiconductor to increase hybrid vehicle efficiency, a structural supercap that handles stresses and vibrations without affecting performance, a supercap charger/backup controller IC, and a high-voltage/high-current connector for commercial vehicles.
Spansion Courts Carmakers With Cortex-R5-Based MCUs
News & Analysis  
5/19/2014   5 comments
In hopes of gaining a sizable share in the growing automotive chip market, Spansion Inc. is rolling out a new family of automotive MCUs, called Traveo, based on ARM Cortex 5 cores.
NXP Car Plan Teams NFC, Bluetooth
News & Analysis  
5/15/2014   6 comments
The biggest issue for the current version of Bluetooth Low Energy may be "its security and pairing mechanism." NXP is proposing NFC for secure transactions, while BLE offers a data link.
Private Equities Cut Ties to NXP
News & Analysis  
5/15/2014   7 comments
Private equity funds, which bought 80.1 percent of NXP Semiconductors in the fall of 2006, are selling off their remaining NXP shares, terminating their control over the Dutch semiconductor company.
Managing Vehicle Networking
Blog  
5/13/2014   1 comment
The AUTOSAR alliance has been changing the way vehicle networks and ECUs are designed. Different domains in the car have different safety and performance requirements, and the in-vehicle networks must have predictable and secure performance.
Ultracapacitor Breakthrough May Recharge Energy Storage
News & Analysis  
4/23/2014   14 comments
A better material for ultracapacitors is a hybrid composite of graphene flakes and single-walled carbon nanotube, according to researchers at George Washington University.
Will ‘Makers’ Help Chip Guys’ Bottom Line?
Blog  
4/18/2014   44 comments
Are you seeing this newborn love among "makers," board vendors, and chip companies? What mystifies me is not so much the love part, but how anyone could eventually mistake this infatuation for good business.
Power Week-in-Review: Paper Battery, 'Nanobox' Energy Storage & HV SiC MOSFET
News & Analysis  
3/13/2014   Post a comment
This week, a hybrid Li-ion battery pack/supercapacitor system that promises to extend mobile battery performance, a "graphene origami" technique that could pave the way toward practical and efficient hydrogen energy storage, and a high-voltage high-temp SiC power MOSFET.
Design Engineers Take On Component Police
Blog  
2/17/2014   13 comments
Design engineers want to use parts that work. Component engineers and purchasing agents want as few parts as possible. Put the two together, and trouble ensues.
Spansion, Post Merger, to Launch Auto SoC Mid-2014
News & Analysis  
2/5/2014   19 comments
Spansion plans to home in on the automotive market by launching new SoC products, the first fruits of the acquisition of Fujitsu Semiconductor's MCU and analog businesses, in the middle of this year.
Qualcomm LTE IC Makes (Auto-) Grade, But Only in Module
News & Analysis  
1/30/2014   8 comments
As car OEMs put together in-vehicle infotainment and telematics systems based on consumer technologies, the question is: Are these consumer chips automotive-qualified?
CES Mobile Wrap: DSP, GPU, CPU Redefined
News & Analysis  
1/13/2014   4 comments
Apps processor designers are prompted to rethink DSP, GPU, and CPU cores. This year’s CES saw Nvidia’s Tegra K1, MediaTek’s octa-core apps processor, and new generation of Ceva-TeakLite-4 DSP architecture.
Power Tip 66: Reduce EMI From an Offline Power Supply Cost-Effectively
Blog  
12/24/2013   Post a comment
The obvious ways to reduce emissions are to reduce the amplitude of the switching voltage waveform, to divert the current with a shield or capacitor, and/or to add a series impedance. We apply the first two techniques to demonstrate we can build a low-power, AC input adapter to meet EMI emissions without a common-mode inductor.
The Self-Driving Car Will Watch Your Every Move
Blog  
12/20/2013   28 comments
The biggest hurdle for autonomous cars is not whether a car can drive itself from point A to B, but if we can strike a balance in extending human driving abilities into the world of AI.
Slideshow: Long-Life Equipment
Slideshow  
12/17/2013   19 comments
Though some technologies seem to change every day, some live on for years and with good reason: New means unproven.
That A-Ha Moment
Blog  
12/10/2013   17 comments
Larry Desjardin asks the readers about their moments of sudden insight.
NXP’s JV Bets on China’s Tenuous EV Market
Blog  
12/10/2013   3 comments
Given China’s strong government support for new energy technologies, and the fact that China has the biggest, fastest growing automotive market in the world, a plan by the joint venture between NXP and China’s state-owned Datang Telecom Technology Co. to go after automotive is a no-brainer.
Spansion Exec Reassures Fujitsu Customers
News & Analysis  
11/25/2013   9 comments
The most tangible technology advances, after Spansion acquired Fujitsu Semiconductor's MCU/analog business, will come from the adoption of Spansion’s proprietary eCT technology in embedded MCUs -- to be released in 2015.
China's Tianhe-2 Holds Top Spot on Supercomputer List
Slideshow  
11/21/2013   Post a comment
China's Tianhe-2 is the world's most powerful supercomputer, according to a biannual list that measures systems' ability to solve a set of linear equations. Tianhe-2 has a performance of 33.86 petaflop/s on the Linpack benchmark.
Merger Pits Mysterious Tsinghua Unigroup vs. MediaTek
News & Analysis  
11/14/2013   17 comments
The industry landscape among China’s fabless chip companies -- fragmented among too many little players fighting for a low-margin smartphone chip business in the domestic market -- is about to change.
Subtle Power Problem Literally Confounds Logic Circuit
Blog  
11/13/2013   8 comments
Power-supply problems can show up in many ways in a system and steer you down many wrong paths, looking for the cause.
Will Rohm's Fuel Cell Gambit Pay Off?
News & Analysis  
11/11/2013   13 comments
Among a handful of promising companies whose hearts were set on the portable fuel cell market, Japan's Rohm has recently become the first to blink. Although not ditching its nascent fuel cell business, Rohm decided to change focus.
Toyota Case: Vehicle Testing Confirms Fatal Flaws
News & Analysis  
10/31/2013   68 comments
With gag orders, code reviews locked in windowless rooms, and a car attached to a dynamometer, Bookout v Toyota had enough engineering intrigue to make a good thriller. But what the experts found was serious stuff. Here's how they showed the defects that cause unintended acceleration.
Toyota Case: Inside Camry’s Electronic Control Module
News & Analysis  
10/30/2013   45 comments
In many recent Toyota cases, one nagging question recurs: If software bugs are in the system, why have millions of owners never experienced unintended acceleration? The trial transcript explains the complexity.
Toyota Trial: Transcript Reveals 'Task X' Clues
News & Analysis  
10/29/2013   37 comments
Expert witness Michael Barr said he’s not allowed to talk about specifics on Task X. However, the trial transcript offers ample clues about what it does.
Nice Circuit, Ugly Schematic
Blog  
10/21/2013   33 comments
The wiring schematic is a standard part of a design’s "reveal." When it is done with the right engineering esthetic, it reflects well on the design and the designer.
Slideshow: ITS Touts Automation & Big-Data
Slideshow  
10/17/2013   9 comments
ITS World Congress turns out to be a confluence of disparate industries -- foremost among them automotive, mobile, telecommunications, and computers.
IDT CEO Shuffle: Why & What Next?
News & Analysis  
10/14/2013   31 comments
When Ted Tewksbury suddenly retired as CEO of Integrated Device Technology seven weeks ago, neither he nor the company explained what happened, or why.
Mike Noonen, GloFo Executive VP, Resigns
News & Analysis  
10/7/2013   19 comments
Mike Noonen has resigned from his position as the executive vice president at GlobalFoundries. Noonen was responsible for global products, design, sales, and marketing at the world’s second largest foundry.
Power Week in Review: Harnessing Lightning, Supercap Forecast & Power Semis
Blog  
10/3/2013   1 comment
This week, scientists use "lightning" to charge a mobile phone, supercapacitors see a positive forecast, the power semi market loses steam, and Bill Schweber presents a fundamentals course on energy management.
What’s Going Through This Driver’s Head?
Blog  
10/3/2013   45 comments
The idea of self-driving cars is stirring discussion, not just on technology and safety, but also the legal implication. And then, there is one more item making some people nervous.
Unlocking the Keyless Car Future
Automotive DesignLine Blog  
10/2/2013   33 comments
For just about everything we do these days, “there's an app for that.” Is the car key destined to become one more little tile on a smartphone screen?
Power Week in Review: Remote Wireless Power Demo, Faraday Cage Breakthrough & EV Charging Diodes
Blog  
9/12/2013   Post a comment
A new wireless power technology delivers power to devices up to 10 feet away. Elsewhere engineers have developed a way to transfer power and data electromagnetically through a Faraday cage. New products include SiC-replacement diodes, high-reliability double-layer capacitors, and a PAR38 spotlight reference design.
Average Vehicle Age Hits 11 Years
News & Analysis  
9/1/2013   12 comments
How old is your car? Your car may be younger than the average vehicle age on the road.
Japan to Form Power Device Initiative
News & Analysis  
7/31/2013   10 comments
Unlike the CE market, there are no established testing procedures for power devices used in vehicles or other high-voltage, high-current infrastructure equipment. It could result in life and death issues, warned an Advantest executive.
Car Hacking: NXP Pushes Flexible Security
News & Analysis  
7/11/2013   25 comments
NXP early on realized that automotive security could benefit from the company’s experience in developing a "secure element" – successfully deployed in millions of smartcards.
Cornell Dubilier Type CS multilayered polymer capacitors
Product News  
6/27/2013   Post a comment
Cornell Dubilier's RoHS-compliant multilayered polymer capacitors support 125°C applications.
High rel capacitors resist vibration and operate to 135ºC
Product News  
6/19/2013   Post a comment
DMTL has made available a limited number of engineering kits, which will introduce designers to the features and benefits of Suncon's EP-Cap polymer hybrid electrolytic capacitors.
Auto MLCC series offers 0402 case size with X8R dieletric
Product News  
6/13/2013   Post a comment
Vishay has extended its VJ automotive series of SMD MLCCs to save board space and increase reliability.
Cornell Dubilier expands aluminum polymer capacitor lines
Product News  
6/5/2013   Post a comment
Cornell Dubilier's two aluminum polymer capacitor series are now available with lower ESR and higher capacitance values for board-level power-conversion applications.
Intel’s Haswell puts more analog inside
News & Analysis  
6/4/2013   5 comments
Inside Haswell, Intel’s next CPU, are twenty of more custom inductors, designed and made by Intel to support its new on-chip voltage regulator.
Stackpole RAF Series chip resistor arrays provide size, weight reduction
Product News  
5/30/2013   Post a comment
Stackpole is offering a small chip resistor array, consisting of two or four isolated 0201 equivalent resistors in a single rectangular-shaped chip with no scallops or holes.
Capacitors provide high reliability for +28V power supplies in military and aerospace apps
Product News  
5/22/2013   Post a comment
Vishay Intertechnology extends 597D series of solid tantalum chip capacitors with new DLA-approved devices.
Kemet multilayer stacked capacitors offer high temperature reliability
Product News  
5/16/2013   Post a comment
KEMET has introduced new KEMET Power Solutions High Temperature (KPS HT) Multilayer stacked capacitors.
Safety capacitor range offers higher capacitance values
Product News  
5/9/2013   Post a comment
Syfer has added to its UL and TÜV approved range of SMD 250 Vac safety capacitors.
Vishay enhances vibration capability in T16 series aerospace capacitors
Product News  
5/3/2013   Post a comment
Vishay’s T16 series of tantalum-cased wet tantalum capacitors with glass-to-tantalum hermetic seals is now available in the A, B, C, and D case codes.
Active antennas invade next-gen smartphones
Design How-To  
4/29/2013   Post a comment
OEMs trying to span more spectrum bands and ultimately boost coverage, battery life and data rates.
Stackpole expands current sense chip resistor line
Product News  
4/25/2013   Post a comment
Stackpole has added 0402 and 0603 sizes to its CSRF Series of foil on ceramic carrier current sense chip resistors.
Page 1 / 2   >   >>


Most Recent Comments
engineers
 
Weapon
 
rick merritt
 
rick merritt
 
Loser99
 
Aeroengineer
 
Aeroengineer
 
Aeroengineer
 
gfcorbett
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Glen Chenier

Engineers Solve Analog/Digital Problem, Invent Creative Expletives
Glen Chenier
Post a comment
An analog engineer and a digital engineer join forces, use their respective skills, and pull a few bunnies out of a hat to troubleshoot a system with which they are completely unfamiliar. ...

Max Maxfield

What's the Best Traveling Toolkit?
Max Maxfield
13 comments
A few years ago at a family Christmas party, I won a pocket knife as part of a "Dirty Santa" game. This little scamp was a Buck 730 X-Tract. In addition to an incredibly strong and sharp ...

Rishabh N. Mahajani, High School Senior and Future Engineer

Future Engineers: Don’t 'Trip Up' on Your College Road Trip
Rishabh N. Mahajani, High School Senior and Future Engineer
10 comments
A future engineer shares his impressions of a recent tour of top schools and offers advice on making the most of the time-honored tradition of the college road trip.

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
41 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Top Comments of the Week
Flash Poll
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)