Power Week: Toyota Develops SiC Transistor, Structural Supercap & More
News & Analysis 5/22/2014 1 comment
Toyota unveils an in-house-developed SiC power semiconductor to increase hybrid vehicle efficiency, a structural supercap that handles stresses and vibrations without affecting performance, a supercap charger/backup controller IC, and a high-voltage/high-current connector for commercial vehicles.
NXP Car Plan Teams NFC, Bluetooth
News & Analysis 5/15/2014 6 comments
The biggest issue for the current version of Bluetooth Low Energy may be "its security and pairing mechanism." NXP is proposing NFC for secure transactions, while BLE offers a data link.
Private Equities Cut Ties to NXP
News & Analysis 5/15/2014 7 comments
Private equity funds, which bought 80.1 percent of NXP Semiconductors in the fall of 2006, are selling off their remaining NXP shares, terminating their control over the Dutch semiconductor company.
Managing Vehicle Networking
Blog 5/13/2014 1 comment
The AUTOSAR alliance has been changing the way vehicle networks and ECUs are designed. Different domains in the car have different safety and performance requirements, and the in-vehicle networks must have predictable and secure performance.
Will ‘Makers’ Help Chip Guys’ Bottom Line?
Blog 4/18/2014 44 comments
Are you seeing this newborn love among "makers," board vendors, and chip companies? What mystifies me is not so much the love part, but how anyone could eventually mistake this infatuation for good business.
CES Mobile Wrap: DSP, GPU, CPU Redefined
News & Analysis 1/13/2014 4 comments
Apps processor designers are prompted to rethink DSP, GPU, and CPU cores. This year’s CES saw Nvidia’s Tegra K1, MediaTek’s octa-core apps processor, and new generation of Ceva-TeakLite-4 DSP architecture.
Power Tip 66: Reduce EMI From an Offline Power Supply Cost-Effectively
Blog 12/24/2013 Post a comment
The obvious ways to reduce emissions are to reduce the amplitude of the switching voltage waveform, to divert the current with a shield or capacitor, and/or to add a series impedance. We apply the first two techniques to demonstrate we can build a low-power, AC input adapter to meet EMI emissions without a common-mode inductor.
NXP’s JV Bets on China’s Tenuous EV Market
Blog 12/10/2013 3 comments
Given China’s strong government support for new energy technologies, and the fact that China has the biggest, fastest growing automotive market in the world, a plan by the joint venture between NXP and China’s state-owned Datang Telecom Technology Co. to go after automotive is a no-brainer.
Spansion Exec Reassures Fujitsu Customers
News & Analysis 11/25/2013 9 comments
The most tangible technology advances, after Spansion acquired Fujitsu Semiconductor's MCU/analog business, will come from the adoption of Spansion’s proprietary eCT technology in embedded MCUs -- to be released in 2015.
Will Rohm's Fuel Cell Gambit Pay Off?
News & Analysis 11/11/2013 13 comments
Among a handful of promising companies whose hearts were set on the portable fuel cell market, Japan's Rohm has recently become the first to blink. Although not ditching its nascent fuel cell business, Rohm decided to change focus.
Toyota Case: Vehicle Testing Confirms Fatal Flaws
News & Analysis 10/31/2013 68 comments
With gag orders, code reviews locked in windowless rooms, and a car attached to a dynamometer, Bookout v Toyota had enough engineering intrigue to make a good thriller. But what the experts found was serious stuff. Here's how they showed the defects that cause unintended acceleration.
Nice Circuit, Ugly Schematic
Blog 10/21/2013 33 comments
The wiring schematic is a standard part of a design’s "reveal." When it is done with the right engineering esthetic, it reflects well on the design and the designer.
IDT CEO Shuffle: Why & What Next?
News & Analysis 10/14/2013 31 comments
When Ted Tewksbury suddenly retired as CEO of Integrated Device Technology seven weeks ago, neither he nor the company explained what happened, or why.
Mike Noonen, GloFo Executive VP, Resigns
News & Analysis 10/7/2013 19 comments
Mike Noonen has resigned from his position as the executive vice president at GlobalFoundries. Noonen was responsible for global products, design, sales, and marketing at the world’s second largest foundry.
Unlocking the Keyless Car Future
Automotive DesignLine Blog 10/2/2013 33 comments
For just about everything we do these days, “there's an app for that.” Is the car key destined to become one more little tile on a smartphone screen?
Japan to Form Power Device Initiative
News & Analysis 7/31/2013 10 comments
Unlike the CE market, there are no established testing procedures for power devices used in vehicles or other high-voltage, high-current infrastructure equipment. It could result in life and death issues, warned an Advantest executive.