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posted in January 2012
Printed electronics startup plans pilot production line
News & Analysis  
1/26/2012   1 comment
PragmatIC Printing Ltd., a developer of printed electronic technology, has announced plans to begin pilot-scale production at the government-backed Centre for Process Innovation in Redcar, Northern England.
Plastic memory firm signs partners for printed systems
1/24/2012   5 comments
Thin Film Electronics ASA (Oslo, Norway), a developer of ferroelectric polarization polymer memory, has joined forces with a number of partners to develop a low-cost printed electronic sensor platform that could be used to monitor the temperature of perishable goods such as food and pharmaceuticals.
Coupling a Supercapacitor with a Small Energy Harvesting Source
Design How-To  
1/24/2012   4 comments
Supercapacitors store energy and deliver peak power in support of energy harvesters. This article reviews the characteristics of supercapacitors and the key issues designers should consider when pairing them with small energy-harvesting sources.
High-tech conference promises help with design
Memory Designline Blog  
1/24/2012   Post a comment
DesignCon 2012 starts January 30 and ends February 2nd in the Santa Clara Convention Center.
Ultracapacitor boasts 3,000F, low ESR in rugged design
Product News  
1/20/2012   2 comments
MIL spec qualified ultracap designed for auto, transportation, alternative energy, medical, industrial, and consumer markets.
Vishay WSLP2512 Power metal strip resistor
Product News  
1/20/2012   3 comments
Vishay's new Power Metal Strip resistor in 2512 case size features very high 3 W power rating and extremely low resistance values down to 0.0005 O.
Teardown: The power inverter - from sunlight to power grid
Design How-To  
1/19/2012   2 comments
This teardown of a solar inverter card traces the path of harvested DC power from the photovoltaic panel, through boost conversion, power inverter and massive filtering of the created AC power signal required by the power grid.
Power electronics for smart energy require innovative packaging technology
Design How-To  
1/17/2012   1 comment
Power electronics is becoming increasingly important when it comes to Smart Energy markets such as regenerative energy, e-mobility and energy saving. In order to tap into these markets, innovations in packaging technology are needed in five areas: Solder joints, module base plates, module layout, chip temperatures, and current densities.
Murata LXWS series capacitive coupling wireless charging system
Product News  
1/12/2012   2 comments
Murata's LXWS series capacitive coupling wireless power transmission module enables wireless recharging of tablet PCs and other mobile devices.
Guest commentary: CFLs and their "issues"
Engineering Pop Culture!  
1/10/2012   59 comments
A newsletter reader responds with some thoughtful points about CFLs, reliability, and more
Out of Europe: Top auto electronics articles 2011
Design How-To  
1/3/2012   Post a comment
As with elsewhere in the world, there is interest in EV and hybrid electric technologies.
Top ten Audio Designline articles for 2011
Audio DesignLine Blog  
1/3/2012   Post a comment
Here are the top ten (most popular) technical articles on Audio Designline during 2011.
Audio components integrate into a printed circuit board
News & Analysis  
1/1/2012   1 comment
Soundchip in Switzerland has integrated electrical and audio components, including acoustic waveguides and vias, into a printed circuit board to make audio systems smaller and cheaper.
Web-based software package optimizes the selection of multilayer capacitors
Product News  
1/1/2012   Post a comment
Syfer Technology has announced a web-based software package designed specifically to help designers select the optimum multilayer capacitor devices for their next design.
Film capacitors offer wide range with low insertion height
Product News  
1/1/2012   Post a comment
TDK-EPC has developed a wide range of EPCOS MKP and MKT film capacitors with low insertion heights.


NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used in Orion Spacecraft, part of NASA's Mars mission. Live radio show and live chat. Get your questions ready.
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