Ultra-thin power inductors target mobile devices Product News 10/27/2006 Post a comment Total Frequency Control's BRI series of power inductors features a magnetically shielded construction with an overall height of 1 mm, making them suitable for a new generation of mobile phones and other miniature electronic devices.
Researchers find magnetic polymer News & Analysis 10/23/2006 Post a comment ; Researchers from Forschungszentrum Rossendorf discovered a polymer with the ability to show magnetic properties. While the effect is restricted to very low temperatures for the time being, it could be the basis for future magnetic polymers.
Inductor packs high performance in small package Product News 10/10/2006 Post a comment Taiyo Yuden said its new 8-mm square NR8040T series of wirewound inductors offers 10 x 10-mm performance with a 36 percent smaller footprint. Achieving 3.4 amps at 10 microhenries, the power inductor series is said to offer the industry's highest rated current for its size.
Power semis market set for rebound News & Analysis 10/9/2006 Post a comment The power semiconductor market remained flat in 2005 at $11.3 billion following 2004's massive 25 percent expansion, but the mid- to long-term prospects for the sector are promising , driven by a myriad of consumer applications, according to market research group IMS.
Camera chip sensor enables thinner camera phones Product News 10/5/2006 Post a comment OmniVision Technologies has launched its sixth generation 1.3 megapixel CameraChip sensor that features a 2-micron pixel and 1/5-inch optical format. The OV9660 enables a 25 percent thinner camera module, making it a good fit for ultra-slim handset designs.
Chip resistor handles 2 watts in 2512 case size Product News 10/3/2006 Post a comment Stackpole Electronics has introduced a high-power, thickfilm chip resistor in a 2512 case size that is capable of handling 2 watts of power. The RHC series incorporate a unique design with specialized materials and processes that enables the resistors to run typically 30 degrees C cooler than standard 2512 chips.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.