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posted in October 2010
Putting an audiophile "tweak" to the test
Audio DesignLine Blog  
10/27/2010   15 comments
A longstanding audiophile product - a "quantum/superconducting"-based device that claims to achieve previously unnattainable "levels of signal purity and transparency" - undergoes some objective tests by some skeptical audio DIYers.
BI Technologies Model 144 series resistor networks
Product News  
10/27/2010   2 comments
Aimed at military and aerospace applications, TT electronics BI Technologies is offering high-reliability custom resistor networks in hermetically sealed metal or HTCC packaging, enabling harsh environment operation to +175°C.
ARM TechCon Teardown Smackdown: Dell Streak vs. The Archos 7
Blog  
10/26/2010   11 comments
The promo for this ARM TechCon event is actually a bit misleading: “Which tablet PC will come out on top? Watch as EE Times Editors Brian Fuller and Patrick Mannion dissect the inner workings of the devices and explore which is the strongest contender, based on speed, power consumption, display, features and functionality.”
AVX UT series of multilayer chip capacitors
Product News  
10/26/2010   Post a comment
AVX has expanded its MLCC product line to include low profile, fine copper termination versions.
Japanese components vendors in the iPhone 4
Blog  
10/19/2010   17 comments
A focus on manufacturing is probably why Japan is winning design-ins with Apple.
Diodes Inc. DMS3017SSD and DMS3019SSD
Product News  
10/18/2010   Post a comment
Diodes Inc. expanded its DIOFET product portfolio with the introduction of two dual channel devices: The DMS3017SSD and DMS3019SSD.
Chevy Volt flap: What's the big deal?
Automotive DesignLine Blog  
10/18/2010   41 comments
Some fans of electric cars and hybrids, and a few folks in the press, are getting all in a knot about Chevy actually having a "direct link" from the gas engine to the wheels in its Volt "range-assisted" electric car. Well maybe its just good engineering.
Hybrid and electric vehicles pose electric/magnetic isolation challenges
Design How-To  
10/15/2010   12 comments
High voltage and current levels present in hybrid-electric and battery-electric vehicle powertrains require isolation from other electronics and occupants. Capacitive digital isolators are one technology for solving the challenges.
Thinfilm, Xerox PARC team on polymer memory
News & Analysis  
10/13/2010   16 comments
Thinfilm Film Electronics ASA, a provider of polymer memory technology, has announced it is working with Palo Alto Research Center Inc., a subsidiary of Xerox, to develop memory technology enabled through printed electronics.
Stackpole RNCS passivated nichrome thin-film precision chip resistors
Product News  
10/13/2010   Post a comment
Stackpole is marketing its latest RNCS series of passivated nichrome thin-film precision chip resistors as a low-cost alternative to tantalum nitride-based devices.
AVX's TCJ series tantalum polymer capacitor
Product News  
10/12/2010   Post a comment
AVX expanded its TCJ SMD polymer tantalum capacitor series to include the industry's first 1µF/50V and 10µF/35V device.
T&M gets dedicated designline
Test & Measurement Designline Blogs  
10/4/2010   1 comment
Welcome to the Test & Measurement Designline, the latest addition to the EE Times Group's 'heads down' communities designed to help engineers tackle practical, technical and software challenges to bring product specification to reality.


Radio
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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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