Fake components delay designs in Israel News & Analysis 3/29/2007 Post a comment Fake components are delaying several design projects in Israel. According to sources who spoke with EETimes Europe , the fake components, mostly from China, will lead to lost sales at several companies due to the delays.
Parker acquires French EMI shields maker News & Analysis 3/28/2007 Post a comment Parker Hannifin Corp., which owns Chomerics in Europe, has bought, for an undisclosed sum, French electromagnetic interference shielding and thermal management device specialist Acofab SAS and its majority shareholder Adecem SARL.
LED is ultra-thin for mobile phone keypads Product News 3/27/2007 Post a comment ROHM develops an ultra-compact LED in a 0.04 x 0.02-inch footprint for devices that require ultra-compact components such as mobile phone keypads, small dot-matrix units, and compact seven-segment display devices.
Low-frequency, low-current oscillator extends battery life Product News 3/23/2007 Post a comment Micro Crystal's OV-7604-C7 low-frequency oscillator has an operating voltage of 5.5 V down to 1.2 V and a maximum current consumption of 0.5µA at 3 V. The oscillator combines the company's 32,768-Hz timing crystal with a CMOS oscillator circuit and measures 3.2 x 1.5 x 1.0-mm in a ceramic SMD package.
Transducers measure from 50 to 600 A off a single 5-V supply Product News 3/22/2007 Post a comment LEM S.A. added the HASS series to its current transducer families designed to operate from a single 5-V power supply. The seven units offer current measurements from 50 to 600 ARMS, and share the same mechanical design, measuring 1.6 x 1.2 x 1.3 in with a 0.8 x 0.4 in aperture for the primary conductor.
OPTEK, IRC deliver LED design kit Product News 3/20/2007 Post a comment OPTEK and IRC have developed a LED design kit for solid-state lighting designers. The kit features IRC's Anotherm aluminum substrates and OPTEK's 1-watt energy-efficient LEDs. Kits include lighting modules, assemblies, components and accessories.
390-volt ultracap module suits heavy-duty apps Product News 3/20/2007 Post a comment Maxwell Technologies has expanded its BOOSTCAP ultracapacitor line with a 390-volt module that offers up to 2.8 times greater energy storage and higher integration than earlier products for hybrid and electric vehicles and heavy-duty industrial applications.
Rotary pot delivers 1 million cycles Product News 3/16/2007 Post a comment BI Technologies Electronic Components Division has developed a 27-mm rotary potentiometer with a life cycle of up to 1 million rotations aimed at heavy-duty and industrial applications.
Flexible circuit cools components on curved surfaces Product News 3/15/2007 Post a comment MH&W International has introduced its Keratherm 86/77 flexible thermal circuit for mounting LEDs and other components on curved surfaces where FR4, MCPCBs and other rigid materials cannot be used. It also replaces thicker, heavier PCBs where size and weight are restricted such as in portable electronics.
HD sensors improve picture quality in digital cameras Product News 3/9/2007 Post a comment Micron Technology has unveiled two CMOS image sensors for mainstream digital cameras and camcorders that are designed to bring exceptional picture quality and ultra-fast burst modes to point-and-shoot digital cameras, features typically found only in high-end digital, single-lens-reflex (D-SLR) cameras.
Power inductors shrink by 50% Product News 3/2/2007 Post a comment Taiyo Yuden's BRL2518 wirewound power inductors offer a 50% smaller footprint with the same 1.2-mm height as the previous model. Measuring 2.5 x 1.8 mm, the BRL2518 series also maintains a high-rated current and low DC resistance.
In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.