Optical sensors meet AEC Q101 qualification Product News 5/31/2007 Post a comment Vishay Intertechnology says it has introduced the industry's first transmissive optical sensors qualified to the AEC Q101 standard. The TCPT1300X01 and TCUT1300X01 sensors are also said to be the industry's first with a MSL 1 moisture rating.
Surface-mount MLCC products extend capacitance values Product News 5/29/2007 Post a comment Kemet developed several new multilayer chip capacitor (MLCC) products in C0G dielectric. Capacitance values have been extended in 25 V rated EIA 0402, 0603, 0805, 1206 and 1210 case sizes. Tolerance offerings include F (±1%); G (±2%); J (±5%); K (±10%); and M (±20%).
Pixel architecture delivers higher performance image sensors Product News 5/25/2007 Post a comment OmniVision Technologies has announced its third-generation pixel design, called OmniPixel3. Featuring a 1.75-micron pixel, this new architecture is expected to deliver image sensors with higher resolution, enhanced performance and improved image quality in a smaller form factor.
European semis distribution sales get lift in Q1 News & Analysis 5/21/2007 Post a comment Sales by members of the Distributors’ and Manufacturers’ Association of Semiconductor Specialists (DMASS) increased by 4.8 percent to Euros 1.48 billion in the first quarter of the year compared with the same period in 2006. The sequential increase from the last quarter of 2006 was 14.5 percent.
Redundant sensor increases safety Product News 5/16/2007 Post a comment MTS Systems has introduced a redundant version of its G-Series Temposonics sensors to offer maximum safety in critical applications, offering up to three independent measurement systems in one package.
Surface mount resistor now has improved power rating Product News 5/15/2007 Post a comment Stackpole Electronics released a product design improvement to the HPC series. The HPC series is a surface mount resistor with a .5 x .5 inch footprint capable of dissipating 5 W continuous power in free air, using the same amount of board space as typical 3 W SMD wirewound devices.
LCD module suits any kind of ambient light Product News 5/15/2007 Post a comment NEC introduces a 3.5-inch LTPS TFT system-on-glass (SOG) LCD module with VGA resolution. The NL4864HL11-01B module expands NEC's offerings to include value-integrated TFT technology, which integrates peripheral circuitry on the glass substrate.
White LED package suits single and array apps Product News 5/10/2007 Post a comment OPTEK Technology has developed a 0.5-W surface-mount white LED package that can be used in both single use and array applications. The OVS5WBCR4 series device measures 6 x 6 mm with an ultra-low-profile of 1.5 mm.
Full-color LED features 130-degree viewing angle Product News 5/9/2007 Post a comment OPTEK Technology has developed a full-color surface-mount LED package with a 130-degree viewing angle. The ultra-low-profile OVSPRGBCR4 device, designed for high current drive, offers high luminance and a long operating life.
Transistor targets tactical air navigation system, short pulse applications Product News 5/9/2007 Post a comment Tyco Electronics released the M/A-COM MAPRST1030-1KS, a 1,000 W peak, class C, bipolar transistor designed for 1030 MHz pulsed-avionics applications. The transistor is suited to operate in IFF/TACAN (tactical air navigation system) or similar short-pulse formats and features a minimum gain of 8.0 dB (>8.6 dB typical) with 45% minimum collector efficiency (>50% typical) on a 50 Vdc supply.
Epson invests in RuBee technology pioneer News & Analysis 5/8/2007 Post a comment Asset tracker specialist Visible Assets Inc., one of the main backers of wireless RuBee technology, has received a 'strategic' investment from Epson Electronics, whose value has not been revealed
SMD resistors target applications with pulse power requirements Product News 5/1/2007 Post a comment Stackpole Electronics released the RPC series of surge-withstanding SMD resistors for applications with pulse requirements. The series is a thick-film SMD chip resistor with improved surge-handling characteristics over standard commercial thick-film chips as well as SMD metal-electrode leadless-face (MELF) resistor types.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.