Inductors deliver low inductance, low DCR Product News 5/30/2008 Post a comment Vishay has launched a toroidal, high-current, high-temperature inductor that touts the industry's highest rated saturation current, and the industry's lowest inductance and direct current of resistance (DCR).
Thermal management in digital and RF designs Design How-To 5/19/2008 Post a comment Increased power density, higher wattage components, and the upward spiral in switching frequencies have become the primary drivers in the search for more efficient and cost effective thermal management. In this article, we shall address some of the industry issues and solutions related to thermal management in digital and RF designs.
Sensors surprise with complexity Blog 5/14/2008 Post a comment Over decades, sensors were high-precision devices but their function was simple and one-dimensional. And they were analog. Nowadays, the world no longer is that simple " sensors get digital and their properties are defined by their algorithms. This creates a new complexity that calls for methods to handle.
Point of resistance Power DesignLine Blog 5/6/2008 Post a comment How often is the derivative of a variable, versus a variable itself, the major driver for the class of equations we deal with on a day-to-day basis; moreover, what does HP's invention of the "fourth passive element," the memristor, hold for power electronics?
Industrial MEMS vibration sensor mitigates risk of system failure at a lower cost Product News 5/5/2008 Post a comment Analog Devices has introduced a low-cost, high-bandwidth MEMS vibration sensor to enable better monitoring of industrial equipment performance and to reduce downtime due to unforeseen system failures. The ADXL001 is said to deliver high-performance and high-reliability vibration monitoring in a small 5 x 5-mm ceramic package at nearly half the cost of current solutions.
OnChip delivers tiny silicon capacitor Product News 5/1/2008 Post a comment OnChip Devices has released a wire-bondable miniature silicon chip capacitor that the company claims is the industry's smallest and thinnest, measuring 10 x 10 mils sq. (0.25 x 0.25 mm) with thicknesses as thin as 4 mils (0.1 mm).
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.