How to design with capacitive digital isolators Design How-To 5/28/2009 Post a comment To ease the design of isolated systems, this article describes the basic functionality of a capacitive, digital isolator, explains its placement within the signal path, and provides important recommendations for a successful circuit board design.
Micronas rolls 3D hall sensor Product News 5/20/2009 Post a comment For applications requiring three-dimensional position measurements, Micronas has developed a 3D hall sensor. The device is implemented as a monolithic component, allowing for higher operational temperature range than competing products, the vendor claims.
MH.W : Thermal tape links components to heat sinks Product News 5/15/2009 Post a comment Keratherm KL 90, a highly thermally conductive, double-sided adhesive tape, provides 1.4 W/mK of thermal conductivity – nearly three times higher than other thermal tapes – for more effective heat transfer from hot components to heat sinks.
Distributors' association sees end to declines Product News 5/13/2009 Post a comment The pace of decline of electronic components distribution in Europe slowed during the first quarter of the year but, according to the International Distribution of Electronics Association (IDEA), they still show every indication of bucking the historic annual billings trend of a strong Q1 followed by three declining quarters.
Syfer : MOV planar arrays protect against transients Product News 5/13/2009 Post a comment The latest range of metal oxide varistor (MOV) planar arrays from Syfer Technology are designed specifically to deliver comprehensive protection against lightning strikes and other transient events in military, aerospace and other safety critical applications.
Allegro : Hall-effect sensor adapts to target Product News 5/6/2009 Post a comment The ATS617 from Allegro MicroSystems is a three-wire differential Hall-effect sensor that combines enhanced EMC capability with a peak-detecting algorithm that provides design flexibility by offering the ability to sense a wide range of target geometries.
Get the Fundamentals Design How-To 5/5/2009 2 comments When I was a junior intern in the late 1970s, I once asked a senior mentor to tell me the secret of his great success as an engineer. After a brief moment of introspection, he replied, "Get the fundamentals."
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.