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Content tagged with Passive
posted in May 2010
Strengths and weaknesses of common resistor types
News & Analysis  
5/31/2010   4 comments
Understand the key parameters of this vital passive component and how they trade off against each other
Two ways to learn and share ideas
Industrial Control DesignLine Blog  
5/26/2010   Post a comment
Check out MEMS symposium at The Sensors Expo on June 7th in Rosemont, IL. Also, here's an opportunity to show and tell your team's industrial control projects.
Student Entrepreneur: Overture and beginners
Blog  
5/26/2010   4 comments
My name is Simon Barker and I am an electronics entrepreneur. Or at least I want to be.
Integrated baluns shrink Bluetooth antenna connection
Product News  
5/24/2010   Post a comment
Two passive ICs from STMicroelectronics NV allow designers to connect an antenna to a Bluetooth transceiver using a single chip.
Intersil aims to become $1 billion player
News & Analysis  
5/14/2010   3 comments
Intersil has raised its second quarter outlook.
Silicon wafer shipments up
News & Analysis  
5/14/2010   Post a comment
Worldwide silicon wafer area shipments increased.
Probe card market looking up
News & Analysis  
5/13/2010   Post a comment
The ATE probe card market is looking up after the downturn in 2009, according to VLSI Research Inc.
Philips replaces 60-W standard bulb with 12-W LED alternative
Product News  
5/13/2010   5 comments
At the Lightfar International tradeshow here, Royal Philips Electronics today unveiled its 12 watt EnduraLED light bulb it claims is the first LED replacement for a 60 watt incandescent light bulb.
Cadence to buy Denali for $315 million
News & Analysis  
5/13/2010   4 comments
EDA software vendor Cadence Design Systems Inc. (San Jose, Calif.) has entered into a definitive merger agreement to buy memory model company Denali Software Inc. (Sunnyvale, Calif.) for $315 million in cash. Denali is expected to have approximately $45 million in cash at closing.
HTC sues Apple over phone, pad and pod
News & Analysis  
5/13/2010   Post a comment
HTC Corp., maker of the so-called Google phone, took legal action against Apple Inc. on Wednesday (May 12), filing a complaint with the International Trade Commission to halt the importation and sale of the iPhone, iPad and iPod in the United States.
A4 processor found inside next-gen Apple iPhone
News & Analysis  
5/12/2010   Post a comment
Apple Inc.'s next generation iPhone will use its new A4 applications processor and support video capture.
Enables ZigBee function integration in smart energy end devices
Product News  
5/12/2010   Post a comment
SyChip has introduced SyNode, a smart energy embedded module dubbed SN3020 that it claims is the smallest, lowest-power, fully compliant ZigBee module supporting Smart Energy and Home Automation profiles.
Freescale backs Liquavista for e-reader displays
News & Analysis  
5/12/2010   Post a comment
Electrowetting display provider Liquavista has said it is working with Freescale Semiconductor Inc., a supplier of microprocessors for e-readers.
DuPont claims OLED record fit for TV apps
Research  
5/12/2010   Post a comment
DuPont claims to have achieved record performance in printed organic light emitting diode (OLED) displays.
Design Rivers: Radical innovation
Blog  
5/12/2010   1 comment
A panel of design experts tackles the issue of radical innovation and how to balance innovation against market pressures.
Welcome to the new EETimes Products
Product News  
5/12/2010   Post a comment
EE Times Products: All the details to take your design full circle.
Reactions mixed to home mesh networking effort
News & Analysis  
5/12/2010   1 comment
Reactions to plans to create a mesh standard for home networks have been mixed as backers praise the effort as the future of whole home coverage, competitors from the Zigbee Alliance critique it as a late comer, those with who have worked on other wireless mesh standards indicate it won't be easy -- and some still haven't heard about it.
Nikon's fab tool biz down in '09
News & Analysis  
5/11/2010   Post a comment
Nikon Corp.'s fab tool business saw its net sales drop by 31.7 percent from the previous fiscal year to 150.1 billion yen ($1.6 billion).
TSMC approves $1.6 billion capex plan
News & Analysis  
5/11/2010   Post a comment
Silicon foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. has approved a $1.647 billion capital spending program, including plans to build a new fab in central Taiwan.
First MEMS gyro smartphone to ship in June; it won't be the last
News & Analysis  
5/11/2010   4 comments
Next month's rollout of the first smartphone to pack a MEMS gyroscope is the industry's worst-kept secret. The vendor is a mystery, but the MEMS gyro's rapid adoption by the rest of the field is a certainty.
Welcome to the new EETimes Design site
Design How-To  
5/11/2010   1 comment
EE Times Design: Spot a trend, see the whole picture, start innovating
Wintegra tries again for an IPO
News & Analysis  
5/10/2010   Post a comment
Wintegra Inc. has filed for an initial public offering in the United States--again.
Marvell plans 40-nm ARM server processors
News & Analysis  
5/10/2010   10 comments
Marvell Technology Group Ltd. aims to supply silicon for ARM-based servers with 40-nm multicore processors it will ship this year and is working with multiple partners including one that hopes to port a server version of Microsoft Windows to ARM.
DRAMs are hot, but NAND is not
News & Analysis  
5/10/2010   2 comments
DRAMs are hot. NAND flash is not.
Introduction to High-Speed Digital Design Principles
Design How-To  
5/10/2010   Post a comment
This white paper discusses some of the major factors that need to be considered in designing an embedded product and the various high-speed digital design concepts that play a vital role in the functionality of the hardware/product as a whole.
Guide to Embedded Systems Architecture - Part 4: Application layer networking protocol examples
Design How-To  
5/10/2010   Post a comment
Examples included in this final excerpt from the book "Embedded Systems Architecture: A Comprehensive Guide for Engineers and Programmers" demonstrate networking protocols - FTP, SMTP and HTTP - implemented in both general-purpose and market-specific applications.
Algorithmic delay and synchronization in MPEG audio codecs
Design How-To  
5/5/2010   Post a comment
This article shows the delays of the popular audio codecs and how they're derived, and offers a convenient reference for designs of time-critical systems having a delay budget.
Generalisimo Francisco Franco is still dead - and so is Vinyl
Audio DesignLine Blog  
5/5/2010   1 comment
Music shipment data is out for 2009, and a graph of that data helps put the popularity of the various formats - i.e., digital downloads, CD and vinyl LP - into perspective.
Automotive rear seat entertainment system - Your mobile living room
Design How-To  
5/4/2010   1 comment
Here's a look at tomorrow's multiple in-car entertainment options and how they may be implemented, using STMicroelectronics' STi71xx as an example.


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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
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