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posted in May 2014
Power Week: Toyota Develops SiC Transistor, Structural Supercap & More
News & Analysis  
5/22/2014   1 comment
Toyota unveils an in-house-developed SiC power semiconductor to increase hybrid vehicle efficiency, a structural supercap that handles stresses and vibrations without affecting performance, a supercap charger/backup controller IC, and a high-voltage/high-current connector for commercial vehicles.
Spansion Courts Carmakers With Cortex-R5-Based MCUs
News & Analysis  
5/19/2014   5 comments
In hopes of gaining a sizable share in the growing automotive chip market, Spansion Inc. is rolling out a new family of automotive MCUs, called Traveo, based on ARM Cortex 5 cores.
NXP Car Plan Teams NFC, Bluetooth
News & Analysis  
5/15/2014   5 comments
The biggest issue for the current version of Bluetooth Low Energy may be "its security and pairing mechanism." NXP is proposing NFC for secure transactions, while BLE offers a data link.
Private Equities Cut Ties to NXP
News & Analysis  
5/15/2014   7 comments
Private equity funds, which bought 80.1 percent of NXP Semiconductors in the fall of 2006, are selling off their remaining NXP shares, terminating their control over the Dutch semiconductor company.
Managing Vehicle Networking
Blog  
5/13/2014   1 comment
The AUTOSAR alliance has been changing the way vehicle networks and ECUs are designed. Different domains in the car have different safety and performance requirements, and the in-vehicle networks must have predictable and secure performance.


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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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