MEMS pack up for production Product News 6/5/2003 Post a comment The microelectromechanical systems (MEMS) market has been plagued by two key challenges for several years: the lack of high-volume manufacturing and the absence of low-cost packaging.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.