MEMS pack up for production Product News 6/5/2003 Post a comment The microelectromechanical systems (MEMS) market has been plagued by two key challenges for several years: the lack of high-volume manufacturing and the absence of low-cost packaging.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.