BGA package prevents digital content piracy Product News 6/27/2006 Post a comment IRC has developed a high-speed digital termination BGA package that is designed to prevent signal theft in digital consumer electronics devices by placing all the termination balls and circuitry on the bottom side of the device.
Capacitor offers low inductance Product News 6/22/2006 Post a comment AVX Corp. has developed a land-grid array (LGA) capacitor using a fine copper termination process to produce advanced decoupling capacitors that offer extremely low equivalent series inductance.
Compact low-leakage filters have innovative design Product News 6/22/2006 Post a comment With the FN 3025 and FN 3026 three-phase filters, Schaffner introduces a new housing concept, offering EMC filters in compact, light weight design with high functionality and distinctive safety elements. The low-leakage EMC filters come in modern plastic housings, with a design that simplifies handling and helps to reduce the installation time.
Solid tantalum chip caps offer five case sizes Product News 6/21/2006 Post a comment Vishay's Hi-Rel COTS T83 series solid tantalum chip capacitors offer a choice of standard and low-ESR values in five different case sizes. Capacitance values range is from 0.1 microF to 330 microF; voltage range is from 4 V to 35 V.
Maxwell offering 2-week delivery on ultracaps News & Analysis 6/20/2006 Post a comment Maxwell Technologies Inc. has unveiled a quick-turn program for its Boostcap ultracapacitor modules. The program offers 14-day shipment for custom-configured multi-cell energy storage and power delivery solutions for systems requiring up to 540 volts.
Philips acquires MRI company for $1.3B News & Analysis 6/15/2006 Post a comment Royal Philips Electronics has
signed a definitive agreement to acquire Intermagnetics General Corp., a supplier of superconductive magnets for magnetic resonance imaging (MRI) systems, for $1.3 billion in cash.
SMT transformers meet the requirements of VDSL2 News & Analysis 6/14/2006 Post a comment EPCOS has developed a series of SMT transformers to meet the requirements of Deutsche Telekom’s new VDSL2 network. The transformers support high transmission rates of up to 100 Mbit/s and offer an extensive bandwidth from 138 kHz to 17 MHz.
Tiny SAW resonator targets RKE apps Product News 6/13/2006 Post a comment Murata touts that the latest addition to its SAW resonator product line is the industry's smallest device in a 3 x 3-mm package that's being mass produced for remote keyless entry applications.
2006 chip market to grow 9.8%, says SIA News & Analysis 6/7/2006 Post a comment The Semiconductor Industry Association (SIA) has revised upwards projected worldwide sales of chips for 2006, and now suggests growth of 9.8 percent to $249 billion, up from its previous estimate of 7.9 percent growth to $245 billion.
Stackpole converts to copper-plated steel lead wire Product News 6/6/2006 Post a comment Stackpole Electronics has announced plans to change the lead wire material for its standard carbon-film resistors and jumper wire products from tinned copper to tinned copper-plated steel to help offset increases in the price of copper.
EMI filters optimized for Vicor V-I chip Product News 6/1/2006 Post a comment Picor has expanded its QPI QuietPower input filter product line with two product additions that are optimized for use with Vicor's V-I Chip devices. The QPI-12 and QPI-10 V-I Chip EMI filters target AdvancedTCA applications.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.