Freescale hits GaAs on RF basestation ICs Product News 6/30/2010 1 comment Freescale is moving into gallium arsenide for monolithic microwave basestation ICs that harness ultralow-noise amps for trunk network amplifier radio cards and as predrivers for its high-voltage lateral diffusion MOS power amps.
Samsung, TSMC hit by ITC complaint News & Analysis 6/28/2010 3 comments STC.UNM (STC)--the technology-transfer arm of the University of New Mexico (UNM)--said that it is charging Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Samsung Electronics Co. Ltd. with alleged patent infringement.
transceiver Product News 6/28/2010 1 comment TI TUSB1310 provides essential physical-level functions, features sensitivity twice the USB 3.0 requirement
CoorsTek buys ceramics unit for $245M News & Analysis 6/28/2010 Post a comment CoorsTek Inc., a manufacturer of ceramic and specialty material components, has signed a definitive agreement to purchase the advanced ceramics business of Saint-Gobain for about $245 million.
Obducat CEO resigns amid losses News & Analysis 6/28/2010 1 comment Amid losses and order delays, Patrik Lundstrom has been named acting CEO of Obducat AB (Malmo, Sweden), a supplier of nano-imprint lithography tools.
Report: Firms buy stake in PSi News & Analysis 6/28/2010 Post a comment Integrated Micro-Electronics Inc. (IMI)and Narra Venture Capital II have acquired a 67 percent stake in PSi Technologies Inc. (PSi) of the Philippines for $30 million.
Atmel completes sale of fab in France News & Analysis 6/24/2010 Post a comment Germany's LFoundry GmbH, an analog and mixed-signal foundry, has completed its previously-announced acquisition of Atmel Corp.’s wafer fabrication operation in Rousset, France.
Precision resistor arrays stabilize and enable miniaturization of electronic circuits Design How-To 6/24/2010 Post a comment This article shows how thin-film chip resistor arrays can positively affect a circuit’s electric stability while at the same time minimizing the area required. Using the example of a voltage divider, the relative parameters “tolerance matching” and “TCR tracking” are explained and the temperature behavior of resistor arrays is discussed. In addition, it is shown how the tolerance and temperature coefficient of resistors can be controlled during the production proces
Trio forms 3-D chip alliance News & Analysis 6/21/2010 2 comments Elpida Memory Inc., Powertech Technology Inc. and United Microelectronics Corp. (UMC) have formed an alliance to speed up the development of three-dimensional (3-D) chips.
Philips tests home health care devices News & Analysis 6/14/2010 Post a comment Philips Research is exploring the horizon for wearable sensors that measure an increasing number of vital signs to deliver devices that make meaningful predictions about health care while keeping a lid on the devices' power consumption.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.