IC supplier, customer cooperation methodologies drive up electronics system quality Design How-To 7/13/2012 1 comment Although IC manufacturers have been extremely successful in reducing defects, on the other hand a significant part of the quality drive for printed-circuit-board module makers is stemming from reducing electrical over-stress (EOS), electrostatic discharge (ESD), and cases of no-trouble-found (NTF). Solution of these problems requires the involvement of the PCB module maker and the automotive manufacturer as well.
Advanced capacitors ensure long-term control-circuit stability Design How-To 7/2/2012 Post a comment Tantalum and niobium-oxide technology meet industry needs for rugged capacitors that maintain high-performance standards under electrical and mechanical stresses. Technical improvements have been made that strengthen the structure of the capacitor and give it more robust performance in a variety of uses. And application guidelines aid design engineers.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.