IC supplier, customer cooperation methodologies drive up electronics system quality Design How-To 7/13/2012 1 comment Although IC manufacturers have been extremely successful in reducing defects, on the other hand a significant part of the quality drive for printed-circuit-board module makers is stemming from reducing electrical over-stress (EOS), electrostatic discharge (ESD), and cases of no-trouble-found (NTF). Solution of these problems requires the involvement of the PCB module maker and the automotive manufacturer as well.
Advanced capacitors ensure long-term control-circuit stability Design How-To 7/2/2012 Post a comment Tantalum and niobium-oxide technology meet industry needs for rugged capacitors that maintain high-performance standards under electrical and mechanical stresses. Technical improvements have been made that strengthen the structure of the capacitor and give it more robust performance in a variety of uses. And application guidelines aid design engineers.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.