Breaking News
Content tagged with Passive
posted in September 2003
Magnetic components sector pulls upward
News & Analysis  
9/29/2003   Post a comment
Rising demand and a sales uptick have analysts believing that the magnetic components market may be headed for stabilizing prices, restored profits, and tighter inventories the remainder of the year.
As component demand improves, raw materials hold fairly steady
News & Analysis  
9/29/2003   Post a comment
Though prices of some raw materials used in electronic components are edging up, there is no indication of a return to the steep price hikes and shortages that led some suppliers to engage in long-term agreements three years ago.
Inductors measure up
Product News  
9/25/2003   Post a comment
Pulse's high-efficiency, high-frequency PA051X series of shielded inductors for multiphase voltage regulator modules (VRMs) has more than twice the energy storage density (microjoules/mm3) of any other inductor of comparable size for VRM10 apps, the company said.
Ceramic capacitors roll with increases in values
Product News  
9/25/2003   Post a comment
Designed to replace aluminum electrolytic and tantalum capacitors, Murata Electronics North America Inc.'s new line of miniaturized multilayer ceramic chip capacitors offers an increased capacitance range up to 100 microfarads with voltage values of 6.3 volts.
Power resistor chips roll
News & Analysis  
9/25/2003   Post a comment
AVX to take tantalum charge
Product News  
9/19/2003   Post a comment
Power resistor chips roll
Product News  
9/18/2003   Post a comment
Vishay Intertechnology Inc. says its two new series of thin-film, wire-bondable resistor chips provide one of the industry's best combinations of power-handling capacity and size for power supplies and high-power circuits in amplifiers.
Integrated passives roll out lead-free
Product News  
9/11/2003   Post a comment
California Micro Devices will introduce what the company calls a pioneering complete product portfolio of lead-free (Pb-free) application-specific integrated passives (ASIP) products for wireless handsets and personal digital assistants (PDAs).
Passives makers less heartened by mobile market rebound
News & Analysis  
9/9/2003   Post a comment
Recent reports that mobile phone sales are rebounding after two years of stagnation represents mixed news for passives suppliers, many of which are seeing increases of unit sales for wireless handset parts negated by ongoing price erosion. Thus, passives manufacturers have yet to enjoy the same degree of optimism as their counterparts in the semiconductor industry. Spencer Chin has this report.
Passives makers less heartened by mobile market rebound
News & Analysis  
9/8/2003   Post a comment
Recent reports that mobile phone sales are rebounding after two years of stagnation represents mixed news for passives suppliers, many of which are seeing increases of unit sales for wireless handset parts negated by ongoing price erosion.
Bulk metal foil resistor nets have low TCR tracking
Product News  
9/4/2003   Post a comment
Vishay Intertechnology Inc. says its ultraprecision bulk metal foil resistor networks provide a tracking thermal coefficient of resistance (TCR) of 1 ppm/ degrees C and stability of 0.01 percent at 0.1 watt in a small-outline, eight-pin Jedec MS-012 package.
Capacitor arrays tout fast decoupling
Product News  
9/4/2003   Post a comment
With inductance values as low as 15 picohenries, AVX Corp.'s LICA capacitor arrays perform high-speed decoupling for multiple signal paths in high-frequency switching applications.
Small inductors have high energy density
Product News  
9/4/2003   Post a comment
Pulse Engineering Inc. has high-efficiency, high-frequency shielded inductors for multiphase voltage regulator modules. Packaged in a 7 x 7 x 5-mm footprint, the PA051X series is said to offer more than twice the energy storage density (microjoules/mm3) of other inductors of comparable size, thus minimizing ac and dc losses.
Components tap WLAN chip sets
Product News  
9/4/2003   Post a comment
Driven by suppliers of wireless-LAN chip sets, passive-component manufacturers are developing innovative devices and technologies to meet the requirements for high-performance characteristics such as quality, or "Q," factor, equivalent-series resistance (ESR) and small packaging in the WLAN.


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4 comments
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10 comments
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42 comments
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