Magnetic components sector pulls upward News & Analysis 9/29/2003 Post a comment Rising demand and a sales uptick have analysts believing that the magnetic components market may be headed for stabilizing prices, restored profits, and tighter inventories the remainder of the year.
Inductors measure up Product News 9/25/2003 Post a comment Pulse's high-efficiency, high-frequency PA051X series of shielded inductors for multiphase voltage regulator modules (VRMs) has more than twice the energy storage density (microjoules/mm3) of any other inductor of comparable size for VRM10 apps, the company said.
Ceramic capacitors roll with increases in values Product News 9/25/2003 Post a comment Designed to replace aluminum electrolytic and tantalum capacitors, Murata Electronics North America Inc.'s new line of miniaturized multilayer ceramic chip capacitors offers an increased capacitance range up to 100 microfarads with voltage values of 6.3 volts.
Power resistor chips roll Product News 9/18/2003 Post a comment Vishay Intertechnology Inc. says its two new series of thin-film, wire-bondable resistor chips provide one of the industry's best combinations of power-handling capacity and size for power supplies and high-power circuits in amplifiers.
Integrated passives roll out lead-free Product News 9/11/2003 Post a comment California Micro Devices will introduce what the company calls a pioneering complete product portfolio of lead-free (Pb-free) application-specific integrated passives (ASIP) products for wireless handsets and personal digital assistants (PDAs).
Passives makers less heartened by mobile market rebound News & Analysis 9/9/2003 Post a comment Recent reports that mobile phone sales are rebounding after two years of stagnation represents mixed news for passives suppliers, many of which are seeing increases of unit sales for wireless handset parts negated by ongoing price erosion. Thus, passives manufacturers have yet to enjoy the same degree of optimism as their counterparts in the semiconductor industry. Spencer Chin has this report.
Bulk metal foil resistor nets have low TCR tracking Product News 9/4/2003 Post a comment Vishay Intertechnology Inc. says its ultraprecision bulk metal foil resistor networks provide a tracking thermal coefficient of resistance (TCR) of 1 ppm/ degrees C and stability of 0.01 percent at 0.1 watt in a small-outline, eight-pin Jedec MS-012 package.
Capacitor arrays tout fast decoupling Product News 9/4/2003 Post a comment With inductance values as low as 15 picohenries, AVX Corp.'s LICA capacitor arrays perform high-speed decoupling for multiple signal paths in high-frequency switching applications.
Small inductors have high energy density Product News 9/4/2003 Post a comment Pulse Engineering Inc. has high-efficiency, high-frequency shielded inductors for multiphase voltage regulator modules. Packaged in a 7 x 7 x 5-mm footprint, the PA051X series is said to offer more than twice the energy storage density (microjoules/mm3) of other inductors of comparable size, thus minimizing ac and dc losses.
Components tap WLAN chip sets Product News 9/4/2003 Post a comment Driven by suppliers of wireless-LAN chip sets, passive-component manufacturers are developing innovative devices and technologies to meet the requirements for high-performance characteristics such as quality, or "Q," factor, equivalent-series resistance (ESR) and small packaging in the WLAN.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.