High-power, flat LED modules Product News 2/26/2010 Post a comment The MiniZeni series from Sharp radiates high efficiency, deliver high color rendering index (CRI) values of up to 87 and boast a long service life whilst measuring only 15x12x1.6mm
Morgan Technical Ceramics aims to pioneer energy harvesting research News & Analysis 2/25/2010 Post a comment Ceramic components manufacturer, Morgan Technical Ceramics, (Stourport, UK) is undertaking a Shorter Knowledge Transfer Partnership (sKTP) project with Glyndwr University (Wrexham, Wales) which will last 26 weeks, is to design and build an energy harvesting demonstration system that will provide a renewable source of energy.
IR rolls GaN devices Product News 2/24/2010 Post a comment International Rectifier Inc. has introduced the industry's first family of commercial integrated power stage products utilizing IR's gallium nitride (GaN)-based power device technology platform.
APEC: Tesla Roadster, solar-panel dangers kickstart power fest News & Analysis 2/24/2010 Post a comment The 25th APEC kicked off with a dynamic plenary session that discussed the past and future of power, exposed the latest improvements to the Tesla Sports Roadster, uncovered the hidden dangers and inefficiencies of solar panels and showed how close-coupling cooling can achieve a 31 percent improvement in cooling efficiency for data centers.
Comment: Sparking interest in engineering Industrial Control DesignLine Blog 2/23/2010 Post a comment Intel is behind a $3.5 billion initiative to support investment in U.S.-based growth-oriented industries. The initiative also wants to increase jobs available this year for recent college graduates.
TSMC, Dialog team on process for power management ICs News & Analysis 2/23/2010 Post a comment Power management chip vendor Dialog Semiconductor plc (Kirchheim-unter-Teck, Germany) has announced it is working with foundry partner Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) on a bipolar-CMOS-DMOS (BCD) manufacturing process technology tailored to power management ICs for portable devices.
Fuel cell system claims 2X efficiency News & Analysis 2/22/2010 10 comments Colin Powell, former secretary of state and now a board member at Bloom Energy, will debut the company's Bloom Box energy generator on Wed. Feb 24th along with the company founder's and California Governor Arnold Schwarzenegger.
Uncle Sam asks consumers to weigh in on smart grid News & Analysis 2/22/2010 Post a comment In an effort to break through electronics-industry logjams, U.S. government policy makers are launching a blog to consumers for comment on a range of questions about smart electric grids including issues about gateways and networks that speak to systems engineers.
KEMET releases new high temperature C0G dielectric platform Product News 2/22/2010 Post a comment KEMET has released new High Temperature Surface Mount C0G multilayer ceramic capacitors (MLCCs) that feature a robust and proprietary base metal dielectric system that offers industry-leading performance relative to capacitance and case size combined with capacitance stability at extreme temperatures up to +200 degrees C.
ARM launches M4 signal-control MCU core News & Analysis 2/22/2010 2 comments ARM Holdings plc (Cambridge, England) has announced the launch of the Cortex-M4 microcontroller core for use in digital signal control and that the core has been licensed by five companies including NXP, STMicroelectronics and Texas Instruments.
RS introduces battery recycling service News & Analysis 2/18/2010 1 comment RS Components has launched a battery recycling service for customers in accordance with Part 2 of The Batteries Directive, The Waste Batteries and Accumulators Regulations 2009, which came into force on 1st Feb 2010.
Intel lab explores nanoscale power storage News & Analysis 2/18/2010 1 comment Intel researchers are exploring nanoscale materials that could be used to create ultracapacitors with a greater energy density than today's lithium ion batteries as part of work in a new lab dedicated to work on microgrids.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments