MIT solar startup aims to beat coal on price News & Analysis 3/28/2008 1 comment Massachusetts Institute of Technology professor Ely Sachs has said he plans for a startup company called 1366 Technologies (Lexington, Mass.) to develop an improved silicon-based solar cell that can beat coal on cost efficiency.
BMW mulls all-electric car News & Analysis 3/19/2008 Post a comment Against the background of increasingly crowded urban agglomerations and under pressure to reduce greenhouse emissions, BMW has announced to develop what it calls "entirely new vehicle concepts." In this context, the company also considers to build all-electric cars.
Cost-effective AC Induction Vector Control Drive Using Single Shunt Current Sensing Design How-To 3/19/2008 Post a comment Against the background of rising demand for energy-saving industrial and home appliances, conventional AC induction motor applications strongly need optimization since they waste about 50 percent of the electrical energy. System costs and power consumption can be drastically reduced utilizing digital control of an analog motor circuit. The article describes how the Freescale MC56F80xx microcontroller family can be used in such motor control applications.
Mitsubishi claims record polysilicon PV conversion News & Analysis 3/19/2008 Post a comment Mitsubishi Electric Corp. (Tokyo, Japan) has claimed to have achieved a world record in photoelectric conversion efficiency in a 150-millimeter square practical-use polycrystalline silicon solar cell, with a rate of 18.6 percent. This represents an improvement of 0.6 percent over the company's previous record.
Power controller supports upcoming PoE standard Product News 3/18/2008 Post a comment Akros Silicon's Powered Device controller implements the 2-Event Physical Layer Classification functionality of the IEEE 802.3at standard, which raises the maximum available PD input power to 30W from the previously specified level of 13W, opening a range of new applications for Power-over-Ethernet.
TI high-performance analog team meets in India News & Analysis 3/18/2008 Post a comment The president and CEO of Texas Instruments said last year that high-performance analog (HPA) could be the core growth engine of the company's future. The HPA team recently held its first-ever review meeting outside in the U.S. in Bengaluru.
Under the Hood: Sonos brings multi-zone digital audio to life Teardown 3/18/2008 Post a comment The designers of the Sonos Digital Music System made four inspired design decisions early on to realize its ground-breaking, multi-room digital audio system, but deep into the design process, even they were humbled by the intricacies of effective wireless system design. See why.
FlatWire aims to short-circuit WPANs Product News 3/18/2008 2 comments FlatWire is said to obviate the need for wireless personal area networks (WPANs) by offering all standard wiring cables in a flat form factor that can be glued to walls and ceilings, then concealed with a coat of spackle and paint.
Solar market grew 62% in 2007 News & Analysis 3/18/2008 Post a comment Despite ongoing polysilicon shortages in the market, world solar photovoltaic (PV) market installations reached a record high of 2,826 megawatts (MW) in 2007, a 62 percent jump over 2006, according to Solarbuzz LLC, a San Francisco-based solar energy consultancy.
Design for Low-Power Manufacturing Test Design How-To 3/18/2008 Post a comment The very process of testing digital circuits routinely increases their dynamic power consumption to levels far exceeding their power specification. The best way to avoid test power problems is to incorporate power-aware testing techniques in the design-for-test (DFT) process.
OLED lighting technology achieves new levels of efficiency Product News 3/17/2008 Post a comment OSRAM has achieved record values of efficiency and lifetime while maintaining the brightness of warm white organic light emitting diodes (OLEDs). For the first time, laboratory researchers have demonstrated it is possible to improve two crucial OLED characteristics simultaneously: efficiency and lifetime.
DC/DC converters housed in chip scale packaging Product News 3/14/2008 Post a comment In chip-scale packaging, AnalogicTech's DC/DC converters will help portable system designers sharply reduce PCB footprint, as well as stray inductance, capacitance and resistance and noise, compared to traditional packaging with bond wires.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.