Rapid growth expected for GaN power management ICs News & Analysis 3/31/2010 Post a comment The market for gallium nitride power management chips is expected to grow to $183.6 million in 2013 from virtually zero in 2010, according to market research firm iSuppli, which most of this growth to occur in 2012 and 2013 as technology advancements reduce the cost of manufacturing.
Groups seek path to bring smart grid home News & Analysis 3/24/2010 2 comments Members of the ad hoc U-Snap Alliance hope to field this summer the first products based on its specifications for carrying smart grid data over home networks, one of a handful of new efforts seeking ways to unite today's fragmented wired and wireless technologies for emerging energy applications.
Google, Microchip develop energy monitor software News & Analysis 3/24/2010 Post a comment Microcontroller company Microchip Technology Inc. (Chandler, Ariz.) has announced the result of a partnership with software giant Google Inc. to produce a reference implementation of the Google PowerMeter application programming interface.
Smart grid group reaches out to consumers News & Analysis 3/23/2010 2 comments A handful of organizations have formed the Smart Grid Consumer Collaborative, a non-profit group that aims to engage consumers in the evolution of the smart grid by conducting consumer research, education and establishing best practices.
DC/DC converter powers digital systems Product News 3/23/2010 Post a comment The BEI15 series of isolated, wide input bipolar DC/DC converters from Murata Power Solutions offers a small footprint for high-current applications in mobile and battery powered products, test equipment and telecom and wireless designs.
Dialog preps power management IC with audio Product News 3/22/2010 Post a comment Dialog Semiconductor plc has announced a system-level power management IC that includes a class G codec. The device is called the DA9057, and has five on-board dc/dc converters to support 24-bit stereo audio headphone playback on a 5-mW power budget.
Smart grid protocol will ride Wi-Fi at home Product News 3/17/2010 Post a comment Zigbee and Wi-Fi backers will collaborate to on bringing the Smart Energy 2.0 protocol to Wi-Fi networks as the first phase of a broad collaboration between the Zigbee Alliance and the Wi-Fi Alliance on wireless home area networks for smart grid applications.
Chip firm makes solar cells on RF production kit News & Analysis 3/15/2010 Post a comment RF Micro Devices Inc., a provider of radio frequency integrated circuits for wireless communications applications, has claimed that it has manufactured the industry's first photovoltaic cell using high-volume six-inch gallium arsenide (GaAs) semiconductor production machinery.
BASF, Li-Tec join European e-car strategy alliance News & Analysis 3/11/2010 Post a comment Chemical company BASF (Ludwigshafen, Germany) and Li-Tec GmbH (Kamenz, Germany), have announced to join the eNOVA e-car strategy alliance. With the move, the group rounds up its expertise spectrum. BASF will contribute materials know-how while Li-Tec produces lithium ion batteries.
Quad output 200W power supplies are compact Product News 3/11/2010 Post a comment With a 3-in. x 5-in. footprint and a height of 1.32-in., Emerson's latest power supplies offer a power density of more than 10 W per cubic inch and are capable of achieving efficiencies of up to 84 percent at full load.
Small-sized PA reduces component cost Product News 3/9/2010 Post a comment Targeted at Bluetooth, 802.15.4/ZigBee and other 2.4 GHz applications, California Eastern Laboratories is now shipping its new µPG2251T6M GaAs power amplifier (PA), which eliminates the need for RF component matching.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.