Embedded Systems Conference
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posted in May 2003
Forging a Brighter Future in High Tech
Design How-To  
5/15/2003   Post a comment
Technical conferences continue to be one of the best and most cost-effective mechanisms for fostering these close relationships and finding out what other organizations are doing. Ian Getreu, the General Chair of the 40th Design Automation Conference (DAC) provides a preview of the show in Anaheim, CA from June 2-6.
Power-One plan aspires to spin silicon into gold
News & Analysis  
5/12/2003   Post a comment
At a time when its sales and earnings remain depressed and near-term visibility is poor, Power-One Inc. is gambling that a strategic shift to silicon-based DC/DC power modules will reap the company long-term dividends.
New chips herald transition to LAN-based power supplies
News & Analysis  
5/5/2003   Post a comment
Semiconductor suppliers are starting to roll out a new generation of power management ICs in anticipation of an IEEE standard drafted to simplify power supplies in a host of emerging communications applications.


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Max Maxfield

March 28 is Arduino Day -- Break Out the Party Hats!
Max Maxfield
6 comments
Well, here's a bit of a conundrum. I just received an email from my chum David Ashton who hails from the "Unfinished Continent" Down Under. David's message was short and sweet; all he said ...

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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