Powering DDR memory and SSTL logic Design How-To 5/24/2011 15 comments While DDR memory is very popular for meeting modern electronics demand for large amounts of high-speed memory in a small form-factor, providing power to DDR memory can pose some difficulties.
Nextreme harvester to power turbine WSN News & Analysis 5/19/2011 2 comments Nextreme Thermal Solutions Inc., a maker of thermal management products, has teamed up with Arkansas Power Electronics International Inc. to develop a thermal energy harvesting system for a wireless sensor network. In particular the WSN is designed to monitor the health of bearings in turbine engines.
60V PowerTrench MOSFET minimizes conduction and switching losses Product News 5/16/2011 Post a comment The FDMS86500L N-Channel, PowerTrench MOSFET from Fairchild Semiconductor is designed specifically to minimize conduction loss, switch node ringing, and to improve the overall efficiency of DC-DC converters in power supplies, motor control, hot swap, and load switch operations, as well as secondary synchronous rectification for servers.
NXP: No-big-chip-in-the-middle strategy Blog 5/11/2011 16 comments Mike Noonen, NXP's senior vice president for global marketing and sales, describes his company's strategy as "no big chip in the middle"--a handset or media tablet without that big fat SoC hogging all the real estate.
Ixys to use GM wafer fab for foundry News & Analysis 5/5/2011 1 comment Ixys Corp. has agreed to establish a "large-scale" power semiconductor fabrication base for General Motors Components Holdings (GMCH) using foundry services from GM's Kokomo wafer fab, Ixys said Thursday (May 5).
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.