Group bids to spend $178M on smart grids News & Analysis 8/27/2009 1 comment A team of utilities, vendors and research groups has submitted a five-year, $178 million proposal to the U.S. Department of Energy to build a smart electric grid demonstration system in the Pacific Northwest region, one of more than 400 bids for economic stimulus grants the DoE has received, contending for as much as $3.9 billion in government funds aimed at accelerating work on smart grids.
Small engines get greener Product News 8/26/2009 7 comments Emissions from small gasoline engines could be reduced using a new analog chip that Freescale Semiconductor introduced at a technology forum in Shenzhen, China.
Fishy power requirements Power DesignLine Blog 8/26/2009 Post a comment MIT researchers have displayed prototype robotic fish that have just ten moving parts, including a single motor. Some prototypes have survived in the lab for four years of constant underwater tests without a leak.
Gartner ups semi market expectations News & Analysis 8/26/2009 Post a comment Strong customer demand and the effects of stimulus packages in China helped to partially iron out the dent in the global semiconductor market. Against this background, market researcher Gartner has lifted its revenue forecast to minus 17 percent for 2009. Earlier, the experts predicted a decline of 22.4 percent. But reasons persist to remain cautious.
Camden : Power fuses conform with IEC 60269 Product News 8/26/2009 Post a comment The CamdenBoss Powerfuse range includes aR semiconductor fuses in 8.5 x 31.5 mm and 10 x 38 mm sizes, aM motor circuit protection fuses in 8.5 x 31.5 mm sizes and gG general fuses in 8.5 x 31.5 mm and 10 x 38 mm sizes.
Trends in power management semiconductors in mobile applications Design How-To 8/25/2009 Post a comment It's a fact, that consumers have an insatiable appetite for smaller, lighter, and function-rich portable electronic devices. But to do so, designers need to grasp integration, and the latest integration trends are in the power management ICs that have come from the simple MOSFET switch, to today's advanced load switches. Learn how with this design article.
Toyota tops 'clunker' sales list News & Analysis 8/25/2009 1 comment Toyota Motor Co. was the primary beneficiary of the U.S. government's "Cash for Clunkers" program, accounting for three of the top five models purchased by new car buyers, according to a new survey of the auto stimulus program.
Carbon nanotube interconnect startup raises $4.1 million News & Analysis 8/25/2009 Post a comment Surrey NanoSystems Ltd. (Newhaven, England) has raised £2.5 million (about $4.1 million) in second round venture capital to help it develop a silicon-friendly, low-temperature carbon nanotube growth process. Surrey NanoSystems believes CNTs can be used as semiconductor interconnect.
Engineer seeks $60 million bonus from Atmel News & Analysis 8/25/2009 3 comments Dr. Andreas Paul Schueppen, a former employee of Atmel Germany GmbH, is preparing for his first day in court in a case filed against his former employer in which he is claiming he is owed 42 million euro (about $60 million) as an "inventor's bonus."
Energy management for automation Design How-To 8/25/2009 Post a comment Energy management and responsible handling of resources is currently the number one topic in industry. In light of this, the Automation Initiative of German Automobile Manufacturers (AIDA) asked the PROFIBUS organization and PROFINET International (PI) to provide functions and mechanisms for PROFINET that support energy-efficient production.
Market researcher: Bosch bought Akustica for its MEMS integration approach News & Analysis 8/24/2009 Post a comment When recently automotive electronics giant Bosch toke over tiny MEMS microphone company Akustica, the reason was the latter one's expertise in integrating MEMS on standard chips, presumes market researcher The Information Network. The move is not intended to help Bosch to enter the electro-acoustic devices market, but strengthen its leading position in the automotive MEMS scene.
Comment: Intel's counsel of complacency on energy efficiency News & Analysis 8/24/2009 Post a comment Intel and Microsoft funded a Stanford University professor, to produce a series of research papers that assess the energy and environmental impacts of information technology. Peter Clarke argues that many of the benefits that have been quantified in this research are already factored in to our apprecation and that more needs to be done than we are inheriting from Moore's Law.
Silicon circuit board seeks to replace ASICs News & Analysis 8/24/2009 Post a comment You may be able to kiss that printed-circuit board good-bye soon, instead mounting bare die on a wafer-scale silicon circuit board that essentially eliminates the power-hungry soldered interconnections between packages.
Daimler plans volume production for e-Smart News & Analysis 8/21/2009 Post a comment Daimler plans to sell an electric version of its Smart sub-compact by 2012. The production of second generation e-smart will start as early as November 2009 albeit for the nonce only for selected users.
BP Solar under fire after PV installation blaze News & Analysis 8/21/2009 1 comment Solar power plants on building roofs are not only a source of energy and income for the operators. They also can catch fire. In the case of a photovoltaics installation in Bürrstadt (Germany), the operator made this experience. Now he battles for the reason of the fire with solar cell manufacturer BP Solar.
Industrial-grade 30-V MOSFETs offer low gate charge solution Product News 8/20/2009 Post a comment International Rectifier has introduced a series of industrial-qualified 30 V TO-220 HEXFET power MOSFETs with low gate charge (Qg) for applications including Uninterruptable Power Supply (UPS) inverters, low voltage power tools, ORing applications and netcom and server power supplies.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.