IPC reactivates lead-free solder issue Product News 9/18/2003 Post a comment In the belief that a proactive approach is the best way to take the lead out, the Solder Products Value Council of IPC (previously the Institute of Interconnecting and Packaging Electronic Circuits) has just released the first of two white papers on lead-free alloys.
Operating System Wars: Coming to a Power IC Near You News & Analysis 9/16/2003 Post a comment The advent of Digitally-Controlled Power (DCP) in electronic equipment promises to bring the flexibility of software programmability to the traditionally hard-wired world of analog power control ICs and subsystems. However, the ascendance of DCP also could spur a battle over power Operating Systems reminiscent of the market fight between Microsoft Windows and Apple's Mac OS. iSuppli analyst Gary Vick has these insights.
Power, thermal management unite Product News 9/11/2003 Post a comment In yet another variation of the one-stop shop, power supply vendors are increasingly taking the first steps toward developing their own brand of standalone cooling products at the systems level.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.