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posted in January 2003
High Tech 2003: Iffy But With Hot Spots
Design How-To  
1/10/2003   Post a comment
Industy analysts have varying opinions to the question, "When will the high-tech recession end?" TechOnLine's Jim Lipman offers his view, along with the technology areas he thinks will show better-than-average performance in 2003.
On-Chip RF-Isolation Techniques
Design How-To  
1/8/2003   Post a comment
Higher frequencies, higher integration levels, and increased analog content on mixed-signal chips is making on-chip isolation more difficult for designers. In this feature article, authors from Cadence and Atheros describe several commonly used isolation techniques that you can often combine to protect your chip designs from noise-induced problems.


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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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