Understanding HSDPA's Implementation Challenges Design How-To 1/28/2005 4 comments HSDPA promises to deliver "true" broadband data pipes to cellular networks. But it also brings with it a set of difficult engineering challenges. Fortunately, by using a software-based design, designers can address these challenges.
Handset hails China's arrival Teardown 1/17/2005 Post a comment The e757 smart phone from TCL contributes to the growing body of evidence proclaiming China's arrival in the handset industry. In a field characterized by rapid change and increasing product sophistication, TCL and its cell phone competitors in China have mounted a serious response to the entrenched and incumbent players, with the group supplying more than half of the domestic Chinese market.
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.