Bluetooth group drops ultrawideband, eyes 60 GHz News & Analysis 10/29/2009 6 comments The Bluetooth Special Interest Group has shelved any plans to use the ultrawideband technology it acquired from the WiMedia Alliance when that group decided in March it would fold, and in its place is conducting due diligence on 60 GHz technology as a possible transport for a future high-rate Bluetooth.
SiRFstarIV modules deliver enhanced GPS receiver capability Product News 10/27/2009 1 comment The first modules, from Vincotech, based on the latest SiRFstarIV technology integrated into the GSD4e chip from CSR open the door for enhanced GPS receiver capability across a broad range of customer applications, including telematics, commercial and consumer mobile devices, providing a significantly improved level of performance.
PC maker sees slow road for USB 3.0 News & Analysis 10/21/2009 1 comment
Description: Intel's decision to wait until 2011 to support USB 3.0 in PC chip sets will put mainstream adoption of the interconnect on hold for a year, said a senior technology manager at a top tier PC maker who also called for separate 60 GHz industry groups to unite in the wake of the failure of wireless USB.
Researcher paves alternate path for hard drives News & Analysis 10/19/2009 Post a comment Carnegie Mellon University professor Jimmy Jian-Gang Zhu is developing a microwave-assisted magnetic recording technique he believes will pack three terabits of data in a square inch of a hard disk, opening a third path in an ongoing debate about the future of the hard drive.
Freescale sees growth in smart metering, mobile medical News & Analysis 10/14/2009 Post a comment Ecology and health concerns are transforming the economic and technological landscape, bringing some significant revenue-producing opportunities to all links to the chain. Texas-based Freescale Semiconductor Inc. has decided to catch the ball on the bounce.
Multimode wireless devices: It's the software, stupid! Design How-To 10/13/2009 2 comments The advent of parallel processing architectures is a big step toward realizing seamless, intelligent connectivity among 3G and 4G wireless standards, but the potential show stopper is the software. Thankfully, some companies are making progress when it comes to enabling hardware and software to work together in harmony.
VT Silicon develops 4G amp, pursues integrated 'front-end' News & Analysis 10/9/2009 Post a comment After 30 months of privately-funded development fabless VT Silicon Inc. (Atlanta, Georgia) has announced a silicon-based power amplifier capable of meeting the operating requirements of 4G wireless data transmissions. The company is planning to launch an integrated RF front-end for WiMax and LTE communications.
AM/FM antenna ICs deliver a variety of integrated features Product News 10/7/2009 Post a comment An active antenna IC designed for AM/FM car antenna applications, the ATR4252 from Atmel Corporation is a highly integrated device that offers a host of features including automatic gain control (AGC), supply voltage regulator with overvoltage protection and an antenna sensor.
Taoglas : SMT GPS antennas resist reflow soldering Product News 10/7/2009 Post a comment Taoglas has launched the SGP series of surface mount (SMT) GPS antenna products guaranteed to pass final device product certification for reflow solder profile tests, device environmental tests (temperature, humidity etc) and mechanical testing (shock, vibration etc.) for machine-to-machine (M2M) telematics devices.
SiBeam readies 2nd gen Wireless HD chip Product News 10/6/2009 Post a comment SiBeam, a pioneer in 60GHz chips for wireless video networking, is demonstrating its second generation chipsets based on the WirelessHD specification at this week's CEATEC Japan exhibition.
Altair offers 4G LTE baseband chip Product News 10/1/2009 Post a comment Altair Semiconductor Ltd. (Hod Hasharon, Israel), a 4G communications chip company, has announced the commercial availability of its LTE baseband chip, the FourGee-3100.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.