Packaging Choices for Wireless IC Designs Design How-To 11/22/2002 Post a comment High-frequency chips pose difficult problems for designers looking for cost-effective, non-performance-limiting packages for these chips. Agilent's Chris Mueth discusses the different types of packages that are available, the required characteristics of these packages, and the need to integrate package and chip analysis into a common design flow.
A Fast Algorithm to Decrease DDS Spurious Signals News & Analysis 11/7/2002 Post a comment Alain Bourdillon, from University de Rennes, France, presents a filtering algorithm, based on the SVD (singular value decomposition) of the Hankel matrix of the signal. This algorithm decreases the level of spurious signals in Direct-Digital Synthesizer (DDS) applications. The spurious free dynamic range improvement of the signal after processing can be as large as 40 dB and depends mainly on the length of the sequence processed and on the accuracy of the calculations performed inside the algori
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.